00195760-0102_UM_D3_SR605_EN - 第16页

1 Introduction User Manual SIPLACE D3 1.1 Description of the machine From software version SR.605.xx 07/2008 EN Edition 16 1.1 Description of the machine 1.1.1 SIPLACE D3 placement machine The SIPLACE D3 placement machin…

User Manual SIPLACE D3 1 Introduction

From software version SR.605.xx 07/2008 EN Edition

1 Introduction

These operating instructions provide a manual or reference work for operating and setting up the

SIPLACE

D3 placement machine.

The header of each chapter contains the release and software version, to which this manual ap-

plies.

Fig. 1.0 - 1 SIPLACE D3 placement machine

1 Introduction User Manual SIPLACE D3

1.1 Description of the machine From software version SR.605.xx 07/2008 EN Edition

1.1 Description of the machine

1.1.1 SIPLACE D3 placement machine

The SIPLACE D3 placement machine is characterized by its high configuration flexibility, excellent

placement rate and maximum precision. The machine covers the SMD spectrum of components

from 0201 to 125 x 10 mm² with a high placement rate.

Two placement methods are used:

– the Collect&Place method with Collect&Place heads for components from size 0201 to fine-

pitch

– the Pick&Place method with the SIPLACE TwinHead for fine-pitch and OSC components

The placement machine is based on a torsionally-rigid and vibration-damped cast steel machine

frame. This guarantees an excellent production quality and less environmental pollution for em-

ployees since the noise of shaking and vibration are reduced to a minimum.

The placement machine has three gantries. There is a placement head on each gantry. These can

be quickly and accurately positioned, moving independently of one another in the X and Y direc-

tions.

Depending on the placement job, a 6-segment or a 12-segment Collect&Place head or a Twin-

Head can be set up. This allows the following configurations:

Fig. 1.1 - 1 Head modularity - SIPLACE D3

Placement area 2

C&P12

C&P12/C&P6/TH

C&P6

Placement area 1

C&P12/C&P6/TH

User Manual SIPLACE D3 1 Introduction

From software version SR.605.xx 07/2008 EN Edition 1.1 Description of the machine

The performance data can be found in Section 3.1 on page 97.

There are four locations for feeding components. Up to four component trolleys can be docked

into each machine. A matrix tray changer may be docked in at locations 2 and 4 in place of a com-

ponent trolley or a waffle-pack changer at location 2.

The placement heads fetch the components from the fixed feeder modules on the component trol-

leys or from the trays in the matrix tray changer, and place the PCBs, which are also stationary.

The placement machine has two placement areas.

– on the single conveyor, one or two PCBs can be placed concurrently.

– on the dual conveyor, up to four PCBs can be placed concurrently.

1.1.2 Selecting the placement head configuration

When you order a SIPLACE D-series placement system, you can select the ideal head configu-

ration for your needs. The placement machine will be configured and supplied as per your order.

There is also a reconfiguration kit if you wish to change the placement head locally. This package

contains the necessary assembly parts, cables, etc., in addition to the placement head. Before

changing the placement head, you should first adapt the station and SIPLACE Pro software. The

system will then have to be recalibrated.

Head modularity, i.e. adapting the machine to the production requirements by changing the place-

ment head, has the advantage that it is an easy way to match the machine to your production

needs without having to invest in further machines.

Placement area 1 Placement area 2

Gantry 1 Gantry 4 Gantry 3

Placement

head

C&P12 C&P12 C&P12

C&P12 C&P12 C&P6

C&P12 C&P12 TH

C&P12 C&P6 C&P6

C&P12 C&P6 TH

C&P12 TH TH

C&P6 C&P6 C&P6

C&P6 C&P6 TH

C&P6 TH TH

TH TH TH