00195760-0102_UM_D3_SR605_EN - 第97页

User Manual SIPLACE D3 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data 97 3 T echnical dat a for the machine 3.1 Performance dat a 3 3 3 3 T ypes of placement head…

2 Operational safety User Manual SIPLACE D3

2.11 ESD guidelines From software version SR.605.xx 07/2008 EN Edition

Always place the modules on a conductive surface (table with an ESD coating, conductive ESD

foam, ESD bag or container).

Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm

away from the screen.

2.11.4 Measurements and modifications to ESD modules

Do not take measurements on the modules unless the following conditions are fulfilled:

– The measuring device is earthed (e.g. via PE conductors) or

– you discharge the measuring head just before taking measurements with a potential-free

measuring device (e.g. by touching an unpainted metal part of the controller casing).

→ Always use an earthed soldering iron if you carry out any soldering work.

2.11.5 Dispatching ESD modules

→ Always store modules and components in conductive packaging (e.g. metallized plastic bags

or metal sleeves) and dispatch them in conductive packaging.

If the packaging is not conductive, place the modules in a conductive envelope before pack-

aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-

ample. NEVER use plastic bags or film. 2

→ If the module has integral batteries, ensure that the conductive packaging does not touch or

short-circuit the battery terminals and, if necessary, first cover the terminals with insulating

tape or material.

User Manual SIPLACE D3 3 Technical data for the machine

From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data

3 Technical data for the machine

3.1 Performance data

Types of placement

head

12-segment Collect&Place head (C&P12)

6-segment Collect&Place head (C&P6)

SIPLACE TwinHead (TH)

PLEASE NOTE IPC value [comp./h]

According to the vendor-neutral conditions of the IPC 9850 standard published

by the Association of Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance

tests. It corresponds to the conditions set out in the SIPLACE scope of service

and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable con-

ditions for each machine type and setting, and corresponds to the theoretical

conditions normally used in the industry.

Number of gantries 3

Placement area 1 Placement area 2 IPC value

[comp./h]

Benchmark value

[comp./h]

Theoretical value

[comp./h]

C&P12 / C&P12 C&P12 37,600 40,400 61,000

C&P12 / C&P12 C&P6 33,200 36,200 52,500

C&P12 / C&P12 TH 28,800 31,400 47,000

C&P12 / C&P6 C&P6 28,500 30,100 43,500

C&P12 / C&P6 TH 24,100 25,300 38,500

C&P12 / TH TH 21,300 23,800 33,500

C&P6 / C&P6 C&P6 25,100 28,100 34,500

C&P6 / C&P6 TH 20,700 23,300 29,500

C&P6 / TH TH 16,900 19,400 24,500

TH / TH TH 11,600 12,500 19,500

Placement posi-

tions

6,000 / gantry for the Collect&Place heads

2,000 / gantry for the TwinHead

Component range 0.6 x 0.3 mm² (0201)

to 85 x 85 mm² / 125 x 10 mm²,

max. 200 x 125 mm² (with restrictions)

Component

height

C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm (larger heights available on request)

3 Technical data for the machine User Manual SIPLACE D3

3.1 Performance data From software version SR.605.xx 07/2008 EN Edition

Placement accu-

racy

C&P12 ± 45 μm (3σ), ± 60 μm (4σ) CO camera, type 28 (18 x 18)

C&P12 ± 41 μm (3σ), ± 55 μm (4σ) CO camera, type 29 (27 x 27)

C&P6 ± 45 μm (3σ), ± 60 μm (4σ) CO camera, type 29 (27 x 27)

TH ± 26 μm (3σ), ± 35 μm (4σ) CO camera, type 33 (55 x 45)

TH ± 22 μm (3σ), ± 30 μm (4σ) CO camera, type 25 (16 x 16)

Angular accuracy C&P12 ± 0.5° (3 σ), ± 0.7° (4 σ) CO camera, type 28 (18 x 18)

C&P12 ± 0.5° (3 σ), ± 0.7° (4 σ) CO camera, type 29 (27 x 27)

C&P6 ± 0.2° (3 σ), ± 0.3° (4 σ) CO camera, type 29 (27 x 27)

TH ± 0.05° (3 σ), ± 0.07° (4 σ) CO camera, type 33 (55 x 45)

TH ± 0.05° (3 σ), ± 0.07° (4 σ) CO camera, type 25 (16 x 16)

Component feed-

ing

4 component trolleys with tape reel holder and integral waste tape container

15 x 30 mm wide locations per component trolley or

MTC in place of component trolleys at locations 2 and 4 or

WPC at location 2

Feeder module

types

Tapes, bulk cases, stick magazines, application-specific OEM feeder modules,

surftape feeder modules (8, 12, 16 mm), waffle-pack trays

Feeding capacity 180 tracks Width: 8 mm 60 S feeder modules, 3 x 8 mm

120 tracks Width: 8 mm 60 S feeder modules, 2 x 8 mm

60 tracks Width: 12 or 16 mm 60 S feeder modules, 12/16 mm

40 tracks Width: 24 or 32 mm 40 S feeder modules, 24/32 mm

28 tracks Width: 44 mm 28 S feeder modules, 44 mm

24 tracks Width: 56 mm 24 S feeder modules, 56 mm

20 tracks Width: 72 mm 20 S feeder modules, 72 mm

16 tracks Width: 88 mm 16 S feeder modules, 88 mm

PCB formats

(LxW)

Single conveyor

50 x 50 mm² to 450 x 460 mm²

50 x 80 mm² to 610 x 460 mm² (Long board option)

Width up to 508 mm with Wide board configuration

Flexible dual conveyor

50 x 50 mm² to 450 x 216 mm²

50 x 80 mm² to 610 x 216 mm² (Long board option)

Width up to 250 mm with Wide board configuration

Flexible dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 380 mm²

50 x 80 mm² to 610 x 380 mm² (Long board option)

Width up to 508 mm with Wide board configuration

PCB thickness 0.3 to 4.5 mm (thicker PCBs available on request)

a) The specified component height may be reduced on the TwinHead in the placement area with two gantries

and a combination of Collect&Place head and TwinHead.

b) With PCB widths > 460 mm make sure that the peripheral modules are also able to process these widths.