00196044-05 - sg x und x4i fse_en - 第330页
Collect, Pick and Place Head (CPP) Pickup and Placement Cycle for CPP Procedure for Placing Components S tudent Guide (FSE) SI PL ACE X Series and X4I Collect, Pick and Place Head (CPP) Edition 01/2 009 EN 330 8.4.7 Proc…
Collect, Pick and Place Head (CPP)
Procedure for Picking Up Components Pickup and Placement Cycle for CPP
Student Guide (FSE) SIPLACE X Series and X4I
Edition 01/2009 EN Collect, Pick and Place Head (CPP)
329
Legend
1. Vacuum measurement pickup/place circuit
2. Optical centering SIPLACE Vision
3. Vacuum measurement hold circuit
A : Rotate component into placement angle
B : Placement angle correction after optical
centering
NOTE:
All vacuum measurements during the placement process are performed in the background and
do not produce any error messages. The error messages concerning missing components etc.
are produced only by the component sensor.
Collect, Pick and Place Head (CPP)
Pickup and Placement Cycle for CPP Procedure for Placing Components
Student Guide (FSE) SIPLACE X Series and X4I
Collect, Pick and Place Head (CPP) Edition 01/2009 EN
330
8.4.7 Procedure for Placing Components
Prerequisite: The pickup process and optical centering must have been completed successfully.
1. The gantry moves over the placement position of the 1st component.
2. Vacuum measurement in pickup/place circuit „closed“
3. The Z axis travels down and interrupts the component sensor.
4. The Z position is read out. The nozzle length and component height are calculated using the value
from the Z axis up pickup procedure.
5. Switch on air blast (pressure control valve, depending on programmed placement profile)
6. The Z axis moves up.
7. The component sensor is released and the Z position is read out. The nozzle length is calculated
using the value from the Z axis down (reference value) pickup procedure. The component is placed.
8. The valve for the segment 1 valve terminal is switched off.
9. A vacuum check is performed when the Z axis is in the top position.
10. The star is rotated and more components are placed.
11. Segment 1 is rotated by the DP drive into the pickup position for the next component (area A or B).
12. Once all 12 components have been placed, the placement process has finished.
Legend
1. Vacuum measurement pickup/place circuit
2. Optical centering SIPLACE Vision
3. Vacuum measurement hold circuit
A/B: Rotate the nozzle for the next component into
the correct pickup angle.
Collect, Pick and Place Head (CPP)
Pickup and Placement Cycle For the Next Components Pickup and Placement Cycle for CPP
Student Guide (FSE) SIPLACE X Series and X4I
Edition 01/2009 EN Collect, Pick and Place Head (CPP)
331
8.4.8 Pickup and Placement Cycle For the Next Components
After all the components of the first head cycle have been placed on the board, the gantry axes move
the placement head to the pickup position of the next pickup cycle.
The next pickup cycle is performed for the components.
If necessary the machine performs repair cycles.
8.4.9 Segment with a "Defective Component“
If the optical centering of a component fails (ident. error) or component recognition before placement
fails, the component will not be placed and will remain on the nozzle.
The turning station will still turn this nozzle to the pickup angle of the new component if this segment
is in area A.
If this segment is in pickup position:
The reject procedure will be activated and
the X/Y axes will move to the reject position for this gantry,
The component will be rejected to the reject box below, via air blast
The new component is picked up.
The rejected component will then be placed in a repair run after all the other placement cycles for this
placement head have been performed.
8.4.10 Finishing Board Placement
After placing the last component, the gantry axes move the placement heads to the waiting position.
An optical nozzle scan is performed after the first board or after the relevant board (depending on
the scan parameters).
The SIPLACE placement station activates the conveyor system and moves the board to the
intermediate/output conveyor.
Finally, the SIPLACE placement station sends the number of consumed components (placed and
rejected ones) to the computer with the OIS (Operator Information System).
The OIS (Operator Information System) calculates the placement statistics referring to the
programmed station setup, the programmed panel or the last reset time. This detailed data is used
to optimize the process.
The machine is now ready for the next board.