Specification SIPLACE X-Series规格说明书1 - 第36页
36 Digital Vision System Checking the Component Quality SIPLACE vision algorithms help with the recognition of • flipped componen ts, • upright components, • poor comp onent qualit y. The digital vision system automatica…
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Digital Vision System
The digital vision system
guarantees extremely fast
and reliable component rec-
ognition, while being very
simple to use. The system
identifies each individual
component from its shape
and color. Even complex
component shapes, such as
flip-chip or CCGA are
detected extremely reliably.
The system is not only used
in the placement head cam-
eras; it can also be found in
the PCB camera. As well as
ensuring that components
are detected accurately, it
also ensures reliable detec-
tion of the ink spots and PCB
fiducials.
The benefits at a glance:
• Extremely fast and reliable
component detection
• Shortest cycle times
• Robust measurement with
reference to the shape
and color
• Straightforward program-
ming
• Offline programming of
package forms
• Rapid introduction of new
products (NPI)
• Open architecture allows
you to quickly adapt to
new requirements
• Optimum placement
results through individual
measurement of each
component
Digital vision cameras
20-nozzle Collect&Place head camera
12-nozzle Collect&Place head camera
6-nozzle Collect&Place head camera
TwinHead standard and high-resolution camera
2 PCB cameras
Examples of digital vision system analysis times
01005 9 ms
PLC44 17 ms
BGA 225 balls 18 ms
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Digital Vision System
Checking the Component Quality
SIPLACE vision algorithms
help with the recognition of
• flipped components,
• upright components,
• poor component quality.
The digital vision system
automatically saves the last
500 images of components
that were identified as “bad”.
SIPLACE users can then
easily demonstrate poor
component quality.
The benefits at a glance:
• Maximum placement qual-
ity
• High first pass yield
• Reduced operating costs
Flipped components Upright components
Poor component quality
Vision Teach menu at the station
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Vision Sensor Technology
PCB Position Recognition
Description
Different fiducial shapes
prove to be optimal depend-
ing on the condition of the
surface.
Particularly advisable for
bare copper surfaces with lit-
tle oxidation is the single
cross. Maximum accuracy is
achieved due to the high
information content.
Rectangle, square and circle
are less “informative” but
save space and can even be
used when oxidation is at an
advanced stage. Advisable
for tinned structures are cir-
cle or square because in this
case the ratio of the fiducial
dimensions to the presolder
thickness is particularly
favorable.
Fiducial criteria
Locate 2 fiducials
Locate 3 fiducials
X-/Y-position, rotation angle, mean PCB distortion
in addition: shear, distortion in X- and Y-direction separately
Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, rhombus,
circular, square, and rectangular contours, double cross, any
pattern
Fiducial surface:
copper
tin
Without oxidation and solder resist
Fiducial warp 1/10 of structure width, both with good con-
trast to environment
Dimensions of synthetic fiducials
min. X/Y size for circle and rectangle: 0.25 mm
min. X/Y size for annulus and rectangle: 0.3 mm
min. X/Y size for cross: 0.3 mm
min. X/Y size for double-cross: 0.5 mm
min. X/Y size for lozenge: 0.35 mm
min. frame width for annulus and rectangle: 0.1 mm
min. bar width / bar distance for cross, double-cross: 0.1 mm
max. X/Y size for fiducial shapes: 3 mm
max. bar width for cross / double-cross: 1.5 mm
min. tolerances, general: 2% of nominal dimension
max. tolerances, general: 20% of nominal dimension
Dimensions of patterns
min. size
max. size
0.5 mm
3 mm
Fiducial environment Clearance around reference fiducial not necessary if there is
no similar fiducial structure in the search area