00198382-03_UM_SIPLACE-CA4-V2_EN - 第113页
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblie s From software version 713.0 Ed ition 12/2019 3.5 Placement head 113 3.5.2.1 T echnical dat a for SIPLACE SpeedSt ar (C&P20 M2) 3 SIPLACE SpeedSt ar (…
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.5 Placement head From software version 713.0 Edition 12/2019
112
3.5.2 Overview
3
Fig. 3.5 - 1 SIPLACE SpeedStar C&P20 M2 - overview
(1) Connection for the holding circuit of the vacuum pump
(2) "Vacuum sensor holding circuit" board (under the cover)
(3) Star motor
(4) Handle (red)
(5) DP drive
(6) Nozzle
(7) Pressure control valve
(8) Z motor (linear motor)
(9) Return cylinder
(5)
(1)
(7)
(2)
(3)
(4)
(6)
(8)
(9)
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.5 Placement head
113
3.5.2.1 Technical data for SIPLACE SpeedStar (C&P20 M2)
3
SIPLACE SpeedStar (C&P20 M2)
With component camera
type 48
With component camera
type 49
Component range
*a
0.12 mm x 0.12 (0201 metric)
to 2220, Melf, SOT, SOD,
Bare-Die, Flip-Chip
0.12 mm x 0.12 (0201 metric)
to 2220, Melf, SOT, SOD,
Bare-Die, Flip-Chip
Component spec.
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4 mm
70 µm
30 µm
100 µm
50 µm
120 µm x 120 µm
6 mm x 6 mm
1 g
4 mm
*b
50 µm
25 µm
50 µm
25 µm
80 µm x 80 µm
6 mm x 6 mm
1 g
Set-down force Touchless Placement, 0.5 N, 1 N to 4.5 N
Nozzle types 40xx 40xx
X/Y accuracy See also section Placement performance and accuracy on page 95.
Angular accuracy ± 0.2°at 3 ± 0.2°at 3
Illumination level 5 5
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific stan-
dards, the component packaging tolerances and the component tolerances.
*)b Due to the focal area of ±0.3 mm, the component camera type 49 requires that you have the correct nozzle length
in relation to the component thickness.
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.5 Placement head From software version 713.0 Edition 12/2019
114
3.5.3 Sensor for the component reject bin
The sensor for the component reject bin monitors whether the reject bin is seated correctly in its
mount.
– If the reject bin was not inserted correctly, the placement machine cannot be started.
– If the reject bin jumps out of its mount during the placement process, the placement machine
will be stopped immediately to avoid a head crash.