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Instruction manual SIPLACE CA4 V2 3 Technical data and assemblie s From software version 713.0 Ed ition 12/2019 3.7 PCB conveyor syst em 137 3.7.7.2 PCB warp age during placement 3 3 Changes in the surface position ar e …

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3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.7 PCB conveyor system From software version 713.0 Edition 12/2019
136
3.7.7 PCB warpage for single lane and dual lane conveyor
3.7.7.1 PCB warpage on the conveyor
PCB warpage across the direction of travel max. 1 % of the PCB diagonal, but not exceeding 2 mm
3
PCB warpage in the direction of conveyor + PCB thickness < 5.5 mm. Bending up of board edge
max. 2.5 mm.
3
3
Fixed clamped edge
Movable clamping device
Printed circuit board
Conveyor side
Fixed clamped edge
Conveyor belt
PCB conveyor direction
Front board edge
Front board edge
Right conveyor belt
Left conveyor belt
PCB conveyor direction
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.7 PCB conveyor system
137
3.7.7.2 PCB warpage during placement
3
3
Changes in the surface position are automatically applied by the functions for learning the height.
3
3
PCB warpage up, max. 2.5 mm
PCB warpage down, max. 2.5 mm
PCB support
To avoid impairing the placement quality and speed, we recommend using a PCB support e.g.
Smart Pin Support so that the PCB warpage downwards does not exceed 0.5 mm.
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.7 PCB conveyor system From software version 713.0 Edition 12/2019
138
3.7.8 Workpiece carrier warpage for panel lane and wafer lane conveyor
3
3
Vacuum tooling
Workpiece carrier
The front and back edge of the workpiece carrier may not be curved upwards. There is no guarantee that
the curvature will be pulled flat by the vacuum tooling.
Warpage across the direction of transport max. 1 % of diagonal but not more than 0.1 mm. The warpage
is then pulled flat by the vacuum tooling.
The side edges may not be curved downwards.
The side edges may not be curved upwards.