00198382-03_UM_SIPLACE-CA4-V2_EN - 第97页
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblie s From software version 713.0 Ed ition 12/2019 3.1 Placement perform ance and accuracy 97 3.1.2 Placement performa nce and accuracy with SWS Placement head…
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.1 Placement performance and accuracy From software version 713.0 Edition 12/2019
96
3.1.1 Placement performance and accuracy with changeover table (SMT)
3
Placement head types:
SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement performance:
The placement performance is affected by the different head combinations and positions, plus the
conveyor configuration. Individual options and customized applications also influence the placement
performance. On request, SIPLACE can calculate the actual performance of your product on your
machine configuration.
Placement accuracy: SIPLACE benchmark value [components/h]
The values are measured during the machine acceptance tests and correspond to the conditions set
out in the SIPLACE scope of service and supply.
The relevant placement accuracy is only guaranteed if the room temperature is between 18°C and
28°C, does not vary by more than ± 1°C and was stable at least 48h before the placement process.
Single lane and dual lane conveyor with pickup from changeover table (SMT)
Process 4 gantries are evaluated statistically together.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 25 µm/3 126,500
2 x C&P20 M2 2 x CPP M_L 25 µm/3 105,500
2 x CPP M_L 2 x CPP M_L 25 µm/3 85,500
Process: 4 gantries are evaluated statistically together.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 20 µm/3 126,000
2 x C&P20 M2 2 x CPP M_L 20 µm/3 105,500
2 x CPP M_L 2 x CPP M_L 20 µm/3 85,000
Panel lane conveyor with pickup from changeover table (SMT)
Process 2 gantries work in one placement area and are evaluated independently from
one another for statistical purposes.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 15 µm/3 83,000
2 x C&P20 M2 2 x CPP M_L 15 µm/3 73,000
2 x CPP M_L 2 x CPP M_L 15 µm/3 63,000
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.1 Placement performance and accuracy
97
3.1.2 Placement performance and accuracy with SWS
Placement head types:
SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement performance:
The placement performance is affected by the different head combinations and positions, plus the
conveyor configuration. Individual options and customized applications also influence the placement
performance. On request, SIPLACE can calculate the actual performance of your product on your
machine configuration.
Placement accuracy: SIPLACE benchmark value [components/h]
The values are measured during the machine acceptance tests and correspond to the conditions set
out in the SIPLACE scope of service and supply.
The relevant placement accuracy is only guaranteed if the room temperature is between 18°C and
28°C, does not vary by more than ± 1°C and was stable at least 48h before the placement process.
Panel lane conveyor with pickup from SIPLACE Wafer System
Process
4 gantries are evaluated statistically together.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 20 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 20 µm/3 43,500 29,500
2 x CPP M_L 2 x CPP M_L 20 µm/3 41,000 29,000
Process 2 gantries work in one placement area and are evaluated independently from one
another for statistical purposes.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 12 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 12 µm/3 43,500 29,500
2 x CPP M_L 2 x CPP M_L 12 µm/3 41,000 29,000
Wafer lane conveyor with pickup from the SIPLACE Wafer System
Process 2 gantries work in one placement area and are evaluated together for statistical
purposes.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 10 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 10 µm/3
*a
43,500 29,500
Process 2 gantries work in one placement area and are evaluated together for statistical
purposes.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x CPP M_L 2 x CPP M_L 10 µm/3 41,000 29,000
2 x C&P20 M2 2 x CPP M_L 10 µm/3
*b
43,500 29,500
*)a The accuracy of 10 µm/3 (the CMK value IS included in the calculation) only applies to the C&P20 M2.
*)b The accuracy of 10 µm/3
(the CMK value is NOT included in the calculation) only applies to the C&P20 M2.
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.1 Placement performance and accuracy From software version 713.0 Edition 12/2019
98
3.1.3 Maximum values
Accuracy
*a
Heads
Flip chip Die Attach SMT
C&P20 M2
CPP M
± 10 µm at 3
± 10 µm at 3
± 10 µm at 3
± 10 µm at 3
± 15 µm at 3
± 15 µm at 3
Placement performance
*b
Heads
Flip chip Die Attach
4 SWS 4 SWS SMT
C&P20 M2
CPP M
46,000 die/h
41,000 die/h
30,000 die/h
29,000 die/h
126,500 com-
ponents/h
85,500 compo-
nents/h
Die / component size
Heads
Flip chip Die Attach SMT
C&P20 M2
CPP M
0.5 x 0.5 mm
*c
*d
to 6 x 6 mm
0.5 x 0.5 mm
c d
to 15 x 15 mm
0.8 x 0.8 mm
to 6 x 6 mm
0.8 x 0.8 mm to 15 x 15 mm
See page 111
See page 111
Die / component supply and feeding
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Component range C&P20 M2: 0.12 mm x 0.12 mm (0201 metric) to 6 mm x 6 mm
CPP M: 0.11 mm x 0.11 mm (01005) to 15 mm x 15 mm
Workpiece carrier -
size
50 mm x 50 mm to 650 mm x 700 mm
Workpiece thick-
ness
0.3
*e
mm to 4.5 mm
*)a 10µm at 3 in placement process with the "Embedded wafer level ballgrid array" option (on request).
*)b The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
*)c Smaller dies on request
*)d Dipping: depends on process
*)e Thinner than 0.3 mm on request
Important notes
When setting up a placement machine (S; F, HS, HF, X or D-Series) next to a SIPLACE CA4 V2, be aware that there is limited room between
the two placement machines. In these cases, use suitable conveyor extensions to create room of 0.5m for the operator between the two
machines.
To achieve top placement performance, fit the first placement machine in a SIPLACE CA4 V2 line with an input conveyor extension and
the last placement machine in the line with an output conveyor extension.