00198382-03_UM_SIPLACE-CA4-V2_EN - 第99页

Instruction manual SIPLACE CA4 V2 3 Technical data and assemblie s From software version 713.0 Ed ition 12/2019 3.1 Placement perform ance and accuracy 99 3.1.4 Configuration overview 3 3.1.5 Component supply 3 Head conf…

100%1 / 322
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.1 Placement performance and accuracy From software version 713.0 Edition 12/2019
98
3.1.3 Maximum values
Accuracy
*a
Heads
Flip chip Die Attach SMT
C&P20 M2
CPP M
± 10 µm at 3
± 10 µm at 3
± 10 µm at 3
± 10 µm at 3
± 15 µm at 3
± 15 µm at 3
Placement performance
*b
Heads
Flip chip Die Attach
4 SWS 4 SWS SMT
C&P20 M2
CPP M
46,000 die/h
41,000 die/h
30,000 die/h
29,000 die/h
126,500 com-
ponents/h
85,500 compo-
nents/h
Die / component size
Heads
Flip chip Die Attach SMT
C&P20 M2
CPP M
0.5 x 0.5 mm
*c
*d
to 6 x 6 mm
0.5 x 0.5 mm
c d
to 15 x 15 mm
0.8 x 0.8 mm
to 6 x 6 mm
0.8 x 0.8 mm to 15 x 15 mm
See page 111
See page 111
Die / component supply and feeding
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Component range C&P20 M2: 0.12 mm x 0.12 mm (0201 metric) to 6 mm x 6 mm
CPP M: 0.11 mm x 0.11 mm (01005) to 15 mm x 15 mm
Workpiece carrier -
size
50 mm x 50 mm to 650 mm x 700 mm
Workpiece thick-
ness
0.3
*e
mm to 4.5 mm
*)a 10µm at 3 in placement process with the "Embedded wafer level ballgrid array" option (on request).
*)b The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
*)c Smaller dies on request
*)d Dipping: depends on process
*)e Thinner than 0.3 mm on request
Important notes
When setting up a placement machine (S; F, HS, HF, X or D-Series) next to a SIPLACE CA4 V2, be aware that there is limited room between
the two placement machines. In these cases, use suitable conveyor extensions to create room of 0.5m for the operator between the two
machines.
To achieve top placement performance, fit the first placement machine in a SIPLACE CA4 V2 line with an input conveyor extension and
the last placement machine in the line with an output conveyor extension.
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.1 Placement performance and accuracy
99
3.1.4 Configuration overview
3
3.1.5 Component supply
3
Head configurations
Placement head
types
SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement area 1 Placement area 2
C&P20 M2 C&P20 M2 C&P20 M2 C&P20 M2
C&P20 M2 C&P20 M2 CPP M CPP M
CPP M CPP M CPP M CPP M
Configurations/options C&P20 M2 CPP M
SWS Flip-Chip X X
*a
*)a Collect&Place mode only
SWS Die Attach X X
*b
*)b 6 magazines with 72 nozzle garages
LDU X on X table X X
LDU 2X on X table X X
LDU X on SWS X X
Nozzle changer X
*b
X
Nozzle changer, "row 2" X X
JTF-S/JTF-M X X
SIPLACE Glue Feeder X X
Component camera, type 45 -- X
Component camera, type 48 X --
Component camera, type 49 X --
PCB camera, type 34 X X
Single lane conveyor X X
Dual lane conveyor X X
Panel lane conveyor X X
Wafer lane conveyor X X
Tape reel diameter
Standard
Maximum
to 432 mm (17")
483 mm (19")
Max. component supply
4 component trolley X
160 feeder modules, each with 8 mm X
Component trolley changeover time < 1 minute
Feeder module types (SIPLACE X) with adapter
Roadrunner, S linear vibratory feeder and label presenter
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.2 Ambient conditions and connection values From software version 713.0 Edition 12/2019
100
3.2 Ambient conditions and connection values
3.2.1 Ambient conditions for packaging, transportation and storage
3
3.2.2 Ambient conditions for placement machine operation
3
Temperature range Between -25°C and 55°C
Atmospheric humidity Up to 95%
Ambient pressure Up to 3000 m height without pressure equalization
Room temperature Between + 15°C and + 35°C
Atmospheric humidity 30% to 75%
(on average not higher than 45%, so that there is no risk of
condensation on the placement machine.)
Ambient pressure > 750 mbar (corresponds to 1700 m above mean sea level)