EUKYX-199-2100_G5S2_Instruction_Vol2_E - 第321页

EUKYX 6-84 199-2100 7.4 "PEC RCG" T est Window 7 . 4.2 PE C Recognition T est Procedure • PEC Recognition T est Preparat ion ( 1 ) Ope n the "PP CHAN GE" window from the "Set up " main menu …

EUKYX

6-83199-2100

7.4 "PEC RCG" Test Window

7.4.1 Manual Alignment Operation

The PEC recognition position is located using the manual alignment operation.

When the [Manual Alignment] button is pressed after the [Move] button is pressed on the "PEC

RCG" test window, the "Manual Alignment" window appears.

[1]

[2]

[3]

Graphic

Development

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[1] [Speed] Button

The beam movement speed in the manual alignment operation is selected from the following items.

[0.5 mm] Button, [2.0 mm] Button, [5.0 mm] Button

[2] [Arrow] buttons

When pressed, the direction to move the beam is specified.

Press the button and then press the [START] button within 10 seconds. The beam is moved at the

speed selected in "[1] Speed Setup" in the arrow direction.

[3] [Rtn] Button

When pressed, the window returns to the "PCB Test" window.

EUKYX

6-84199-2100

7.4 "PEC RCG" Test Window

7.4.2 PEC Recognition Test Procedure

• PEC Recognition Test Preparation

(1) Open the "PP CHANGE" window from the "Setup" main menu to set the pattern program.

(2) Transfer the PCB to be tested onto the PCB positioning section on the "PCB XFER" window

selected from [Setup] menu or "PCB XFER" window displayed by pressing the [PCB XFER]

button on the "PEC RCG" test window.

(3) Press the [Mark Pos Edit] on the “PEC RCG” window to display the “Mark Pos. Edit“

window. Set the PEC recognition mark on the window.

Press the [Mark Data Edit] button on the “PEC RCG” window to display the “Mark Data

Edit“ window. Set each parameter for the PEC recognition mark.

Selecting [Zone n] and [#n] for the global recognition position in the [Set Data (Crnt.PP.)]

window, can set the position data and PEC recognition mark code.

(4) Move the XY beam so that the PEC recognition mark with which the PEC recognition test is

performed, is within the recognition range (camera view).

For the XY beam movement operation, there are two ways; one is "Move", that is a method to

move to the position set on “[Set Data (Crnt. PP.)] window“. The other one is "Manual Alignment

Operation" where the recognition window is displayed and the XY beam position is adjusted

using the manual alignment operation, viewing the recognition image.

Locate the recognition mark close to a corner of the recognition range as shown in the following

figure.

Center of the

Recognized Image

Recognition Mark

Recognition Range

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Procedure

Note

EUKYX

6-85199-2100

7.4 "PEC RCG" Test Window

• Move

(1) Press the [Crnt.PP.Set Data] button on PEC RCG window to display the “Set Data (Crnt.PP.)“

window. Check the “Mark Pos X, Y (Move position)“. Pressing the [OK] button returns to the “PEC

RCG“ window.

(2) When the [START] button on the operation panel is pressed within 10 seconds after the

[Move] button is pressed, the XY beam is moved to the specified position.

• Manual Alignment

(1) Press the [Manual Alignment] button on the “PEC RCG“ window to display the "Manual

Alignment" window.

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(2) Setup the XY beam movement speed using with the "Speed" buttons.

(3) Press the direction button (Upper, Right, Lower or Left Arrows) to setup the beam movement

direction.

(4) Press the [START] button on the operation panel within 10 seconds after pressing the

direction button (The XY beam will be moved to the recognition test position.)

• PEC Recognition Test Execution

(1) Press the [START] button on the operation panel within 10 seconds after pressing the [Recog]

button. (The PEC recognition operation are performed.)

• When the recognition test fails, an error (recognition error) window appears.

Collect each parameter referring to the descriptions in the “Error” window and perform

the PEC recognition test again.

• When the recognition test is completed successfully, make a note of collected parameters

and reflect them onto the pattern program data for the product PCB to be tested.

Procedure