EUKYX-199-2100_G5S2_Instruction_Vol2_E - 第45页

EUKYX 199-2100 Cont-1 Contents Page Chapter 1 Product menu 1. Outline of Menus for Automatic Operation ................................. 1-1 2. "Product" Window ........................................... .....…

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Safety Precautions
EUKYX-Safety
199-X100
Safe-36
Handling solvents (including solder and adhesive)
Cleaning organic solvents, such as isopropyl alcohol (IPA) and ethanol are used for the maintenance
of this machine (including optional units). Additionally, the solder paste printers, dispensers, and
some hybrid placers and flip bonders use solder, flux, or bond, etc. during normal production. Since
many of these materials include organic solvents, great care should be taken when handling them.
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Cautions on handling solvents
1. Hazards to human health
Organic solvents constantly vaporize and contaminate the surrounding atmosphere. Inhaling or
coming in contact with organic solvent vapor may cause serious damage to human health.
2. Flammability
Organic solvents are highly flammable substances and can easily catch fire if handled improperly.
3. Adverse effects on machines
Some kind of solvent may deteriorate parts used in the machine, electric cable sheathes, and other
resin parts.
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To avoid hazards of solvents
• Be careful not to inhale toxic vapors of solvents for extended periods.
• Do not use solvents near fire or flame. Keep solvents away from flame or fire.
• Use only the specified solvent in the correct manner. Do not reuse any solvent
repeatedly, and do not mix with other solvents or chemicals.
• Check the contents of the safety data sheet (MSDS/SDS), thoroughly notify
work personnel of toxicities of included chemical materials and measures to be taken in case
of an accident, and take necessary countermeasures.
• Use appropriate safety gear (safety goggles, protective gloves, and respiratory protective
devices) corresponding to the solvent or material types.
If no safety data sheets are supplied with solvents or materials you have purchased, be sure to
acquire the safety data sheets from the suppliers.
Note
6. Precautionary Items for Correct Operations
EUKYX
199-2100
Cont-1
Contents
Page
Chapter 1 Product menu
1. Outline of Menus for Automatic Operation ................................. 1-1
2. "Product" Window .................................................................... 1-2
2.1 Local Window ............................................................................. 1-2
2.2 Line Window .............................................................................. 1-8
3. "Comp.Reload" Window ......................................................... 1-10
3.1 Cmp.Rem.List .......................................................................... 1-16
4. "OPERATION" Window ........................................................... 1-17
4.1 "Run Mode" Tab Sheet .............................................................. 1-18
4.1.1 With the start of step described .......................................... 1-19
4.1.2 "Run Mode" Window ("Warm Start" Possible) ....................... 1-23
4.1.3 "Run Mode" Window in "Placement Recovery Available" Mode 1-24
4.2 "Opr.Mode" Tab Sheet .............................................................. 1-25
4.2.1 Recog Display ................................................................... 1-26
4.2.2 Image Save ....................................................................... 1-27
4.2.3 Control.............................................................................. 1-29
4.2.4 Comp Handling .................................................................. 1-34
4.2.5 Speed ............................................................................... 1-38
4.2.6 Feeder .............................................................................. 1-40
4.2.7 Tape Pocket Recog ............................................................ 1-42
4.2.8 Splicing ............................................................................. 1-46
4.2.9 Data ................................................................................. 1-48
4.2.10 Noz Blow ......................................................................... 1-50
4.2.11 Flux spread ...................................................................... 1-51
4.2.12 Multi Head ....................................................................... 1-51
4.2.13 Error diagnosis ................................................................ 1-52
4.2.14 Dclr before product .......................................................... 1-53
4.2.15 SL Feeder ....................................................................... 1-55
4.2.16 M2M ............................................................................... 1-56
4.3 "Test Mode" Tab Sheet ............................................................. 1-57
4.4 "Altn Mode" Tab Sheet .............................................................. 1-58
5. "Prod.Dt." Submenu ............................................................... 1-60
6. "Manage" Submenu ................................................................ 1-61
7. "Recall" Submenu .................................................................. 1-62
EUKYX
199-2100
Cont-2
Contents
Page
Chapter 2 Pattern Program
1. Outline of Pattern Program ....................................................... 2-1
2. Composition of Pattern Program ............................................... 2-3
2.1 Composition of Common SET ......................................................2-4
2.2 Composition of PCB Data ...........................................................2-4
2.3 Composition of Operation Data....................................................2-5
2.4 Composition of Control Data .......................................................2-7
2.5 Composition of Placement Nozzle Data .......................................2-9
2.6 Composition of Placement Feeder Location Data ..........................2-9
2.7 Composition of Placement Data................................................. 2-10
3. Explanation of Pattern Program ...............................................2-11
3.1 Common SET ............................................................................2-11
3.2 PCB .........................................................................................2- 11
3.3 Operation ................................................................................ 2-19
3.4 Control .................................................................................... 2-33
3.5 PL Head/Nozzle ....................................................................... 2-43
3.6 CMPNT PL ............................................................................... 2-45
3.7 Placement ............................................................................... 2-48
3.8 HDLG/PL ................................................................................. 2-62