m220_383_02_process_manual工艺手册 - 第27页
PROCESS SETUP AND ACCEPTANCE P ROCESS M ANU AL 3.4.1.2 Formula’s - The general formula that is used for the uniformity cal culation: Uniformity [+-%] = maximum value – minimum value 2 * averag e value - The point-to-poin…
PROCESS SETUP AND ACCEPTANCE
P
ROCESS MANUAL
3.4 Process acceptance conditions
The process specifications of Amtech/Tempress Systems, Inc. can only be guaranteed if the
conditions are satisfied as described in the following sections.
3.4.1
Introduction
The Tempress process is characterised with either film thickness, sheet resistivity, added particle
count, refractive index and/or dopant concentration, where applicable.
3.4.1.1 Uniformity definitions
Standard edge exclusion: 5 to 9 mm depending on wafer size and process unless otherwise stated in
the process specifications.
Table 3-2: Default edge exclusion
Wafer diameter
[mm]
Edge exclusion
[mm]
76.2 4
100 5
125 5
150 6
200 9
300 9
Minimum, maximum and average values are measured over 5 or 9 points as shown in the picture
below. Default amount of measurement points are indicated in
Table 3-3.
Figure 3-4: 5 or 9 measurement point indicator
Table 3-3: Default amount of measurement points
Wafer diameter
[mm]
Measurement points
[nr]
76.2 5
100 5
125 5
150 5
200 9
300 9
3.4-1
PROCESS SETUP AND ACCEPTANCE
P
ROCESS MANUAL
3.4.1.2 Formula’s
- The general formula that is used for the uniformity calculation:
Uniformity [+-%] =
maximum value – minimum value
2 * average value
- The point-to-point (cross wafer) uniformity is presented as an average wafer value +/- the
uniformity in %. It is based on 5 or 9 measurement points as indicated in section Error!
Reference source not found..
P/P Uniformity [+-%] = maximum (point) value – minimum (point) value
2 * average (5 or 9 point) value
- The wafer-to-wafer (cross load) uniformity is presented as an average load value +/- the
uniformity in %. It is based on the average wafer values as determined in the point-to-point
uniformity calculation.
W/W Uniformity [+-%] = maximum (wafer average) value – minimum (wafer average) value
2 * average (all wafer average) value
- The run-to-run uniformity is presented as an average run value +/- the uniformity in %. It is
based on the average load values as determined in the wafer-to-wafer calculation.
R/R Uniformity [+-%] = maximum (load average) value – minimum (load average) value
2 * average (run average) value
Example:
Figure 3-5 : Example of process result calculation
3.4.1.3 Equipment
- Standard Process recipes supplied by Amtech/Tempress Systems will be used for process
acceptance runs.
- All measurement equipment should be supplied by the customer and be available to the
Amtech/Tempress Systems Engineer.
3.4-2
PROCESS SETUP AND ACCEPTANCE
P
ROCESS MANUAL
3.4-3
- Thickness and refractive index measurements should be done with a Plasmos automated
ellipsometer or comparable equipment.
- Sheet resistivity should be measured with an automated 4-point probe or comparable machine.
- Dopant concentration measurement should be supplied by the customer. Dopant variation will
be characterised in absolute percentages and measured with SIMS or a comparable technique.
- Particle measurements should be done with a Tencor Surfscan 6420 or comparable equipment.