00195963-03_MM SWS-EN - 第21页
21 SIPLAC E Wa fer S ystem (SW S) - rear vi ew [1] Bas ic frame [2] Barcode, scanner dependi ng on the c onfigurati on either at the waf er changer or at the gr ipper The pl acement mach ine suppl ies th e compress ed ai…
Overview of the Modules of the SWS
The SWS consists of the following main modules.
SIPLACE Wafer System (SWS) - side view
[1] Gripper [2] Flip unit
[3] Installation location for options (die attach unit or linear dipping unit)
[4]
Die ejector
[5] Supply unit (PC, vacuum pump) [6] X/Y unit
[7] Wafer changer system (magazine lift) [8] Support foot (swung in)
21
SIPLACE Wafer System (SWS) - rear view
[1] Basic frame [2] Barcode, scanner depending on the configuration either
at the wafer changer or at the gripper
The placement machine supplies the compressed air for the SWS (see User Manual). For the vac-
uum supply, the SWS is equipped with a vacuum pump of its own.
Maintenance Schedule
Our maintenance intervals are based on the following machine utilization:
eight hours per shift, three shifts per day, five days per week, four weeks per month.
NOTE
The "dailymaintenance" respectivly "maintenance after each shift" are cleaning works and there-
fore part of the machine handling. They must be carried out as required,
e.g. the waste container will have to be emptied several times a day, depending on the amount of
waste generated.
Maintenance Schedule According to Intervals
Interval
Task
Page
Equipment / spare parts
Daily
Empty reject bin and vacuuming the nozzle
changer
3.7.1
Vacuum cleaner
Weekly
Checking the exhaust air pressure manome-
ter for die attach and flip unit
3.7.2
Mirror
Die attach unit
Cleaning the driver and making sure that it
can easily be movable
3.9.1
Ethyl alcohol, cleaning buds,
lint-free
Flip unit
Cleaning raceway and driver
3.11.1
Ethyl alcohol, cleaning buds,
lint-free
Gripper
Cleaning the gripper jaws
3.12.1
Ethyl alcohol, lint-free cloth
Magazine lift
Cleaning the frame sensor
3.13.2
optical cloth
Magazine lift
vacuuming the magazine support plate
3.13.1
Vacuum cleaner, brush
Wafer table
Cleaning the wafer support rail and checking
for spots of abrasion
3.17.1
Ethyl alcohol, lint-free cloth
1 month
Die ejector
Cleaning the vacuum cap
3.8.2
Compressed air, lint-free cloth,
ethyl alcohol if necessary
Gripper
Cleaning the guides
3.12.2
SIPLACE cleaning tissue
Gripper
Lubricating bearings and driver groove at the
sensor lever
3.12.3
Spray grease (aerosol)