00195963-03_MM SWS-EN - 第22页
Maint ena nce Sched ule Our mainte nance int ervals ar e based on th e followi ng machine utilizati on: eight hour s per sh ift, three s hifts per day, f ive days p er week, f our weeks per month. NOTE The "da ilyma…
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SIPLACE Wafer System (SWS) - rear view
[1] Basic frame [2] Barcode, scanner depending on the configuration either
at the wafer changer or at the gripper
The placement machine supplies the compressed air for the SWS (see User Manual). For the vac-
uum supply, the SWS is equipped with a vacuum pump of its own.
Maintenance Schedule
Our maintenance intervals are based on the following machine utilization:
eight hours per shift, three shifts per day, five days per week, four weeks per month.
NOTE
The "dailymaintenance" respectivly "maintenance after each shift" are cleaning works and there-
fore part of the machine handling. They must be carried out as required,
e.g. the waste container will have to be emptied several times a day, depending on the amount of
waste generated.
Maintenance Schedule According to Intervals
Interval
Task
Page
Equipment / spare parts
Daily
Empty reject bin and vacuuming the nozzle
changer
3.7.1
Vacuum cleaner
Weekly
Checking the exhaust air pressure manome-
ter for die attach and flip unit
3.7.2
Mirror
Die attach unit
Cleaning the driver and making sure that it
can easily be movable
3.9.1
Ethyl alcohol, cleaning buds,
lint-free
Flip unit
Cleaning raceway and driver
3.11.1
Ethyl alcohol, cleaning buds,
lint-free
Gripper
Cleaning the gripper jaws
3.12.1
Ethyl alcohol, lint-free cloth
Magazine lift
Cleaning the frame sensor
3.13.2
optical cloth
Magazine lift
vacuuming the magazine support plate
3.13.1
Vacuum cleaner, brush
Wafer table
Cleaning the wafer support rail and checking
for spots of abrasion
3.17.1
Ethyl alcohol, lint-free cloth
1 month
Die ejector
Cleaning the vacuum cap
3.8.2
Compressed air, lint-free cloth,
ethyl alcohol if necessary
Gripper
Cleaning the guides
3.12.2
SIPLACE cleaning tissue
Gripper
Lubricating bearings and driver groove at the
sensor lever
3.12.3
Spray grease (aerosol)
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Interval
Task
Page
Equipment / spare parts
Gripper
Lubricating the Z guide
3.12.4
Multipette, Lubcon Thermoplex
ALN 1001/00 (left location)
SIPLACE cleaning tissue (right
location)
Magazine lift
Cleaning Z guides and Z spindle
3.13.3
SIPLACE cleaning tissue
Wafer changer
Cleaning the guide rail
3.16.1
SIPLACE cleaning tissue
Wafer table
Cleaning the optical sensors
3.17.3
optical cloth
Wafer table
Cleaning the X and Y spindles and the linear
guides
3.17.4
SIPLACE cleaning tissue
3 months
Die ejector
Cleaning the magnets and ceramic spheres
of the needle system
3.8.3
Lint-free cloth, ethyl alcohol,
cleaning buds, lint-free
Die ejector
Checking the suppression pins of the needle
system
3.8.5
None
Die ejector
Cleaning the prism and the magnetic contact
surfaces at the centering unit
3.8.4
Lint-free cloth, ethyl alcohol,
cleaning buds, lint-free
Die attach unit
Checking the nozzle attachment for leaks
3.9.2
SWS GUI
Die attach unit
Checking the suction plates at the nozzle
take-up for leaks
3.9.3
Suction plates if necessary
Flip unit
Checking the reject bins: emptying, cleaning
the contact surfaces
3.11.5
Lint-free cloth
Flip unit
Making sure, that the rotary part can be
moved easily (it must not get caught in the
raceway)
3.11.2
None
Flip unit
Checking the nozzle attachment for leaks
3.11.3
None
Flip unit
Checking the suction plates at the nozzle
take-up for leaks
3.11.4
Suction plates if necessary
4 months
Die ejector
Checking the sealing ring at the needle sys-
tem and the centering unit for leaks
3.8.6
None
Die ejector
Lubricating the shaft for the Z movement at
the needle system
3.8.7
Spray grease (aerosol)
Die attach unit
Lubricate the Retract Unit and Checking for
Ease-of-Movement
3.9.4
Oil dispenser with Structovis
GHD
Flip unit
Lubricating the linear guides from Rotary
part
3.11.6
Multipette, Lubcon Thermoplex
ALN 1001/00