Galaxy APi Tech Spec Issue 8 - 第2页
2 DEK Galaxy APi Machine Standar d Configuration Standard Configuration Specification Machine Alignment Capability >2 .0 C pk @ +/- 12.5µm, (± 6 Sigma) # Process Alignment Capability >2 .0 C pk @ +/- 12.5µm, (± 6 S…
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DEK GALAXY APi Platform
Technical Specification
Part No. 206012 – Issue 08 – November 2016
2
DEK Galaxy APi
Machine Standard Configuration
Standard Configuration
Specification
Machine Alignment Capability
>2.0 C
pk
@ +/- 12.5µm, (±6 Sigma) #
Process Alignment Capability
>2.0 C
pk
@ +/- 12.5µm, (±6 Sigma) #
Core Cycle Time
7 secs
Maximum Print Area
610mm (X) x 508.5mm (Y)
Printer Construction
One piece optimised welded frame
ISCAN
TM
Machine Control
Motion control using CAN BUS network
Operating System
Windows embedded XP or Windows 7 Standard embedded (option dependent)
Operator Interface
Colour TFT touch screen display, keyboard and trackball with DEK Instinctiv
TM
software.
Camera
HawkEye® 750 digital camera, using IEEE 1394 interface. Multi channel. LED
lighting. FOV 11.3mm x 8.7mm. Inspection window 26mm
2
HawkEye® 750 Functionality
Enabled
Camera Positioning
High accuracy linear motors and encoders with 1 micron resolution
Squeegee Pressure Mechanism
Software controlled, motorised with closed loop feedback
Stencil Positioning
Automatic loading incorporating squeegee drip tray
Stencil Alignment
Motorised via actuators X, Y, and Theta
Under-Stencil Cleaning
Cyclone high speed cleaner, fully programmable with wet/dry/vacuum wipe with
external solvent tank. Including oscillation and quick change cassette.
Vacuum Assist for Under-Stencil Cleaning
On board vacuum unit 35 litres/sec airflow
Squeegee
Clamped double trailing edge squeegee (1 set included)
Tooling Deviation Monitor
Verification of tooling setup via squeegee pressure feedback
Machine Interface
Upline and downline FMI included
Connectivity
RJ-45LAN (networking) and USB2 interface available
Tri Colour Beacon
Programmable with audible alarm
Temperature & Humidity Sensor
Monitoring of the process environment
Documentation
Hard copy manuals comprising: Operator, Installation, Electrical Drawings. On
board technical manuals and tutorials supporting operator functions. CD
containing manuals and tutorials.
# DEK’s machine accuracy and repeatability qualification is certified by 3rd party and undertaken using production
environment process variables. Print Speeds, Print Pressures, Rising Table and Camera Movements are included in the
process capability figure.
3
DEK Galaxy APi
Machine Standard Configuration
Transport System
Specification
Type
Single piece with 3mm round transport belts, front rail fixed
ESD Compatibility
Black transport belts and guides with surface resistivity of greater than 10
6
ohms
but less than 10
11
ohms.
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left
Right to right
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
620mm (X)* x 508.5mm (Y)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
1kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Patented over the top clamps
Substrate Handling Features
Soft rail lift / land
Board clamp regulator
Substrate Underside Clearance
Programmable 3mm to 42mm
*Refer to the Long Board Printing Capability Specification for Under Stencil Cleaner and Fabric sizes
Process Parameters
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 300mm/sec
Print Gap
0mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 20mm
Print Modes
ProFlow®
Print / Print
Print / Flood
Flood / Print
Adhesive
Paste Knead
Programmable: number; period; on demand