KE2040Instruction Manual Ver2.01,REV04.2003.6.25 - 第35页

1 − 18 Component Name Shape MNLA *1 FMLA St an dar d VCS Optional VCS-1 Optional VCS-2 Optional VCS-3 Package Pitc h: 0.65 or more Dimens ions: 20 m m x 20 mm or less, or 23.5 m m (l ength) x 11 mm (w idth) or less Recog…

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1 − 17
(3) Applicable component
Component
Name
Shape
MNLA
*1
FMLA Standard
VCS
Optional
VCS-1
Optional
VCS-2
Optional
VCS-3
Package
0603
○
Square chip
resistor
1005, 1608, 2012, 3216, 3225
(5025, 6432)
○
○
Network resistor (Excluding SOP, SOJ, PLCC types)
○
○
MELF resistor 1.6 x φ1.0mm, 2.0 x φ1.25mm, 3.5 x
φ1.4mm, 5.9 x φ2.2 mm
○
○
0603
○
○
Laminated
ceramic capacitor
1005, 1608, 2012, 3216, 3225, 4532,
5750 (5632)
○
○
Tantalum chip
capacitor
3216, 3528, 6032, 7343
○ ○
Aluminum
electrolytic
capacitor Height:
Height: more than 6 mm, but 10.5
mm or less
○
○ ○
Chip film capacitor
○
○
Variable trimmer capacitor, Chip potentiometer, trimmer
○
○
Chip ferrite beads
○
○
Chip inductor
○
○
Tape
SOT molded part 1608/2012, SOT-23,
SOT-89, SOT-143, SOT-223
○
○
8-, 14-, 16-, 18-, 20-, 24- and 28-pins
Length of a diagonal line: 31.5 mm or
less
○ ○ ○
SOP
32, 40-pin
○ ○
16, 18, 20, 24, 26, 28, 32-pin
○
○ ○
SOJ
40-pin
○ ○
18, 20, 22, 28 (Square),
28 (Rectangle), 32, 44-pins
○
○ ○
PLCC
52, 68, 84-pins
○ ○
Pitch 0.65/0.8/1.0
Dimensions: 20 mm x 20 mm or less
○
○ ○
Pitch: 0.65/0.8/1.0
Dimensions: more than 20 mm x 20
mm or 23.5 mm (length) x 11 mm
(width), but 33.5 mm x 33.5 mm or
less
○ ○
Pitch: 0.4/0.5/0.6/0.8/1.0
Dimensions: 50 mm x 50 mm or less
○
Pitch: 0.3
Dimensions: more than 24 mm x 24
mm, but 33.5 mm x 33.5 mm or less
○
Pitch: 0.3
Dimensions: more than 16 mm x 16
mm, but 24 mm x 24 mm or less
○ ○
QFP, BQFP
Pitch: 0.3
Dimensions: 16 mm x 16 mm or less
○ ○ ○
Dimensions: 20 mm x 20 mm or
less , 23.5 mm(L) x 11 mm(W) or less
○
○ ○
Dimensions: 20 mm x 20 mm , more
than 23.5 mm(L) x 11 mm(W), but
33.5 mm x 33.5 mm or less
○ ○
BGA
Dimensions: more than 33.5 mm x
33.5 mm, but 50 mm x 50 mm or less
○
Tape
Stick
Tray
*1 : applicable to a KE-2020
Table 1-1-6-3
1 − 18
Component Name Shape
MNLA
*1
FMLA Standard
VCS
Optional
VCS-1
Optional
VCS-2
Optional
VCS-3
Package
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or
less, or 23.5 mm (length) x 11 mm
(width) or less
Recognizable with laser
○
○ ○
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or
less, or 23.5 mm (length) x 11 mm
(width) or more but 33.5 mm x 33.5
mm or less
Recognizable with laser
○ ○
Pitch: 0.4 or more
Dimensions: 150 mm x 150 mm or
less
Recognizable with the VCS
○
Pitch: 0.3
Dimensions: more than 24 mm x
24 mm, but 33.5 mm x 33.5 mm or
less
Recognizable with the VCS
○
Pitch: 0.3
Dimensions: more than 16 mm x
16 mm, but 24 mm x 24 mm or less
Recognizable with the VCS
○ ○
Unidirectional lead
connector
Bidirectional lead
connector
Pitch: 0.3
Dimensions: 16 mm x 16 mm or
less
Recognizable with the VCS
○ ○ ○
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or
less, or 23.5 mm (length) x 11 mm
(width) or less
Recognizable with laser
○
○ ○
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or
less, or 23.5 mm (length) x 11 mm
(width) or more but 33.5 mm x 33.5
mm or less
Recognizable with laser
○ ○
Pitch: 0.5 or more
Dimensions: 150 mm x 150 mm or
less
Recognizable with the VCS
○
Pitch: 0.3
Dimensions: more than 24 mm x
24 mm, but 33.5 mm x 33.5 mm or
less
Recognizable with the VCS
○
Pitch: 0.3
Dimensions: more than 16 mm x
16 mm, but 24 mm x 24 mm or less
Recognizable with the VCS
○ ○
IC socket
Pitch: 0.3
Dimensions: 16 mm x 16 mm or
less
Recognizable with the VCS
○ ○ ○
Dimensions: more than 24 mm x
24 mm, but 33.5 mm x 33.5 mm or
less
○
Dimensions: more than 16 mm x
16 mm, but 24 mm x 24 mm or less
○ ○
FBGA
Dimensions: 216 mm x 16 mm or
less
○ ○ ○
Tape
Stick
Tray
*1 : applicable to a KE-2020
1 − 19
Note: For the shape of chip components to be mounted
(1) For the parts whose shape is cylindrical, there is no minimum shade when turned,
and chip recognition by laser align is therefore impossible.
(2) A poor pickup or placement accuracy could result if the top surface of the
component to be placed is curved, protruded, or dented. Avoid using such
components. (Some such components may, however, be handled by changing
the nozzle number.)
<Typical pickup failures>
MO
MO
<Typical poor placement accuracy>
Pickup nozzle
Slotted groove
Embossed characters
Dented
Laser recognition