Vision_Series_EN - 第10页
10 A clean machine: effectiv e Residue Management As is the case with all industrial processes, substances are generated during SMT produc- tion which have to be removed from the process cycle because they contaminate th…
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The centrepiece of our VisionX-Series is the process chamber with its
outstanding heat transfer owing to advanced hole nozzle geometry as
well as monitored adjustable overpressure in the heating module, guar-
anteeing homogeneous and gapless heat transfer to the circuit board.
The inert process atmosphere can be assured throughout the entire
soldering process and beyond because the closed system ensures that
no external air nds its way into the process chamber. The heat flow
within the system takes place by means of circulation, i.e. the process
gas of the preheating and peak zones is extracted, cleaned and reinsert-
ed into the process at the sides.
With a linear prole, the component is not heated
in a stepped manner during soldering, in fact it
is heated along an identical linear temperature
gradient. Linear proles can reduce cycle times
and can help to reduce soldering errors such as
tombstoning.
The component is brought to a temperature
of at least 240 °C for soldering. Using a saddle
prole the board is gradually heated in line with
pre-dened, individual temperature ranges. Even
components with differing thermal masses are
heated homogeneously and temperature differ-
ences minimised.
Saddle prole
Linear prole
Convection
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h1 h2 h3 h4 h5 h6 h7 ec4c3p1 p2 p3 c1 c2
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Separately adjustable heating zones
Reproducible temperature prole
Outstanding process stability with the smallest possible ΔT
Homogenous heat input over the entire PCB thanks to specially designed nozzles
Low maintenance effort
Homogenous heat transfer
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VisionX-Series | Heat transfer
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A clean machine:
effective Residue Management
As is the case with all industrial processes,
substances are generated during SMT produc-
tion which have to be removed from the process
cycle because they contaminate the system. Our
highly effective residue management function
puries the process gas safely and reliably, and
keeps your system clean and dry.
The residue management function included in the
VisionX-Series combines depending on the sys-
tem type two different modes of action: pyrolysis
in the heat zone and cold condensation in the
cooling tract’s lter units. Liquid and crystalline
residues are effectively removed by means of this
combination.
VisonXP+ and Vision XP+ Vac are equipped with
pyrolysis and lter units in the cooling zone as
standard. Pyrolysis can optionally be added to
VisionXS models for the purposes of cold trap-
ping. VisionXC systems are tted with cooler lter
units in their cooling zone.
In order to make your manufacturing system
even more efcient, the VisionXP+ is optionally
available with double pyrolysis. Your system’s
cleaning efciency is signicantly increased. The
rst pyrolysis unit is located underneath the inlet
area. It puries the nitrogen from the heating
zones. The second pyrolysis unit is installed on
top of the inlet area and lters the process gas
from the heating zones. Cleaning efciency is
signicantly increased for the process gas and
the soldering system’s chambers are kept clean
and dry with very little maintenance and minimal
downtime.
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lter
cooler
drop formation
pyrolysis
closed loop process atmosphere closed loop cooling
Residues are separated with the help of a special granulate during
pyrolysis. Long molecular chains are broken down (cracked) into smaller
elements by means of thermal ssion. Temperatures from about 500 °C
are required to this end. Afterwards, the molecular chains are small
enough to be taken up by the granulate and removed from the produc-
tion process. The granulate only needs to be changed once a year, mak-
ing the pyrolysis unit easy to maintain – and you prot from minimal
downtime. Your manufacturing processes continue to run smoothly.
Pyrolysis at 500 °C
Liquid residues condense above all on the cooling
tract’s lter units, by which they are then removed.
The system is easy to clean. The lters are ex-
changed in sets at the back of the system. The
process chamber doesn’t even have to be opened.
Depending on system type, the oven is equipped
with a 2, 3 or 4-stage condensation trap.
Cold condensation
VXP+
Vac
VXP+ VXS VXC
VXP+
Vac
VXP+ VXS
Ecient cleaning for a clean and dry process chamber
System integrated solution
Reliable, stable process
Easy accessibility
Low maintenance effort
low
maintenance
expenses
VisionX-Series | Residue Management