Vision_Series_EN - 第15页

15 Opened vacuum chamber of the VisionXP+ Vac Divided, separately regulated transport system The VisionXP+ Vac has a tripartite transport system: pre-heating/peak area, vacuum unit and cooling z one. All three areas of t…

possible

2-in-1solution for reow soldering

VisionXP+ with or without vacuum

Energy-ecient, low-maintenance and voidless - Rehm offers innova-

tive solutions for reow soldering with a variety of VisionXP+ options.

A new vacuum unit now enables convection soldering processes with

or without vacuum – with only one soldering system!

The VisionXP+ with vacuum option reliably removes voids and out-

gassing immediately after melting the solder – while the solder alloy

is completely in the liquid phase. Void rates of less than 2 % are made

possible with vacuum values between 100 mbar – 10 mbar. Pressure

progress and speed can be set individually and moreover be saved

as prole parameter in the product recipe. This integrated solution

results in a more time-efcient and stable production sequence.

A costly rework or rejection of the pcb assembly due to excessive

voiding is obsolete!

Vacuum measured in the process chamber and not at the vacuum pump

Vacuum down to 10 mbar for reducing the number of voids

Three-part conveyor: heating zone, vacuum zone and cooling zone

Automatic positioning of the process chamber to processing or maintenance position

Outstanding cooling performance

Minimal downtime thanks to low maintenance

void ratios

below

2 %

Opened vacuum chamber of the VisionXP+ Vac

Divided, separately regulated transport system

The VisionXP+ Vac has a tripartite transport system:

pre-heating/peak area, vacuum unit and cooling zone.

All three areas of the transport system can be optionally

equipped with a central support for particularly wide boards.

The possibility of reducing the transportation speed in the

cooling zone when using the vacuum enables the extension

of the cooling time of components and therefore guarantees

an optimum temperature for subsequent process steps. The

throughput of the system is additionally increased with the

expansion of the transport system by a second track.

The vacuum chamber is installed in the VisionXP+ Vac as

an enhancement to the available peak zones. The integrated

pyrolysis and separate ltering of the atmosphere extracted

from the vacuum chamber are additional plus points in terms

of maintenance and cleaning. A generously dimensioned

vertical travel range of the vacuum chamber in the service

position enables good access to the internal mechanisms

during maintenance periods.The automatic running of the

process chamber into the processing or maintenance posi-

tions minimises downtimes and reduces maintenance effort.

All heating zones of the VisionXP+ Vac are regulated indi-

vidually and separated from each other thermally, guaran-

teeing flexible prole guidance and a stable reflow process.

The measurement of a temperature prole with the vacuum

process switched on shows that despite a very low vacuum

of 10 mbar, all prole settings have been fullled (≤ 3 K/s

heating, tL ≤ 90 s, TP ≤ 240 °C). With the help of the heating

integrated into the chamber, the temperature of the compo-

nents inside the vacuum unit can be adapted to the settings

of the most common standards. This rened solution

ensures a time-efcient and stable production process.

Efcient, easy to maintain and void-free

Precise pressure and temperature proling

VXP+

Vac

VXP+

Vac

VXP+

Vac

Pressure and temperature prole of a soldering process with the VisionXP+ Vac

without vacuum with vacuum

VisionX-Series | Vacuum

Parallel processes

Lead-free and leaded soldering in one system

Do you want to run two different processes alongside one

another in the same reow system while ensuring thermally

sensitive circuit board assembly on top of this? In that case

you will need a great deal of exibility when it comes to

parameter setting. The technical conguration of the dou-

ble-track model from the VisionX-Series enables incredibly

exible process set-ups, thus opening up a wide working

window for soldering. The double-track systems are tted

with two transport tracks which can be asynchronously

operated at varying speeds.

Heating zones which are well thermally isolated from one

another, positioned in a grid of 350 mm both above and

underneath the transport tracks along the length of the

process chamber enable a wide range of reflow proles.

Just one homogeneous heating zone with one dedicated

fan stretches across the width of the process chamber

and both transport tracks in each case. There are abso-

lutely zero thermal barriers between the transport tracks

(gas baffle plate) or split nozzle arrays that could individ-

ually influence the gas flow on the right and left transport

tracks, meaning that the temperature and speed of the

gas flowing on both tracks are the same. If the two tracks

have both leaded and lead-free components mounted,

optimum reflow proles can be achieved by means of

different transport speeds. The VisionX-Series offers the

best conditions for this.