Vision_Series_EN - 第22页

22 KIC - Proling Prole Creat or The proling module from KIC enables detailed pr ole creation for new products. It’ s r elatively easy to set up in just a few steps. The settings are sav ed as reference v alues for ot…

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VXP+ VXS VXC
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MES connection and ROI
Long-standing experience with MES connections makes it
possible for Rehm to offer an innovative solution for MES
master computer connection which meets every known re-
quirement of modern MES systems. Communication here is
based on XML logs transmitted via TCPIP. All data relating to
process interlocking, traceability, machine status and other
operating data is exchanged here.
Clearly structured product management ensures in everyday
production that the right reflow program is clearly attributed to
the component/item number to be manufactured. Alongside
the oven settings, component-specic data can also be saved
in product management.
Product management
A variety of packages are possible for the VisionX design
series in the eld of traceability and process interlocking:
› Traceability / Process traceability via hand-held
scanner (order-specific)
› Process interlocking via fixed position scanners
› Process interlocking and traceability via fixed
position scanners
A data set containing the relevant process parameters
during the process is generated in a le for each component
as a basis for all packages. Depending on the package, the
components can, using the barcode scan, be identied on the
component directly or using a routing slip scan (by hand or
stationary). If the package contains process interlocking too,
the scan is compared with the database and the component
is only transported into the oven upon release. With the
traceability option, a data set containing the relevant process
parameters during the process is generated in a le for each
soldered component.
Traceability and process interlocking
Optimal
tracking
ProCap
ProCap guarantees the process stability of the reflow
soldering system for each individual product. The process
parameters are automatically stored for the product upon rst
start-up. Every additional order is compared with the param-
eters stored for this product. Each individual component is
saved to the ongoing product and order and, where applica-
ble, order numbers and serial numbers are stored along with
these. Process deviations and operator errors are logged too.
Gradual changes such as, for example, a clogged lter are
reliably detected.
VXP+
Vac
VXP+ VXS VXC
VisionX-Series | Industry 4.0
22
KIC - Proling
Prole Creator
The proling module from KIC enables detailed prole
creation for new products. It’s relatively easy to set up in just
a few steps. The settings are saved as reference values for
other applications. On the basis of these values, the system
is capable of making temperature suggestions for similar
product lines. If the same product is manufactured again at
a later point in time, and if something has been changed in
the system, no problem. The controller precisely duplicates
the preset conditions, or displays the differences.
The Prole Creator is computer simulation software which
calculates the ideal recipe. It allows you to save time and
money and avoids mismatch and damage in your process. It
eliminates the need to “guess” and guides you to get into the
right direction without going backward and forward. Setting
the right parameters by adjusting zone temperature and con-
veyor speed will produce a thermal prole which matches
your product process window.
tured within the parameters specied. Cost savings can be
achieved through reductions in follow-up work and better
system utilisation.
› Process traceability for each individual
circuit board
› Data management for reflow quality and throughput
› Reduced production costs
› Process quality control
› Automated, continuous profile processing
The RPI (Reflow Process Inspection) supplies information
on an ongoing basis as to the extent that the reflow prole
corresponds to the required specications. It also assists in
the optimum prole creation using existing solder paste and
reflow oven specications, but allowing the creation of own
soldering joint and component specications. The prole
overview together with the service and production data are
reported to the line manager (either on the system or with
remote connection to every linked PC) in order to ensure as
efcient an operation as possible. The RPI improves produc-
tion quality by ensuring that every circuit board is manufac-
RPI
VXP+
Vac
VXP+ VXS
VXP+ VXS
VXP+
SLOPE
PEAK
TAL
SOAK
20 %
40 %
60 %
80 %
100 %
The optimal reow prole
The basis for reliable solder joints
VisionX-Series | Profiling
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VXP+ Vac VXP+ VXS VXC
TRANSPORT SYSTEM
Mesh belt
Single lane
Dual lane
Multi track
Quad lane
RESIDUE MANAGEMENT
Cold condensation with cooler/lter units
only nitro systems
Pyrolysis
2nd Pyrolysis
VACUUM
Vacuum module
COOLING TRACT
Bottom cooling
PCU Power Cooling Unit
integr. cooling circuit and heat exchanger for
connection to ext. facility water supplies
ENERGY EFFICIENCY
Internal cooling / elimination of heat emission
Measurement power consumption
Measurement nitrogen consumption
Supervision of volume flow with active readjustment
SOFTWARE
Product management
Traceability packages
Process interlock
ProCap
Prole Creator
KIC implementation
RPI
MES-Option ROI
OTHERS
Stand-By-Mode
SSP
SSP+
Quick Exhaust
Transmission zone
Software control for fan speed regulation
Pin in Paste
VXP+
Vac
VXP+ VXS VXC
standard optional on request not available
System conguration
VisionX-Series
VisionX-Series | Overview