Vision_Series_EN - 第4页
4 Y our production department can meet any re - quirement using manufacturing equipment from Rehm! With the VisionXC , VisionXS and VisionXP+ we offer different systems for optimum soldering processes in the most diverse…
VisionX-Series
NEW! VisionXP+ Vac
Convection soldering with vacuum
›
The 2-in-1 solution for voidfree reflow soldering
›
Reliable reflow soldering process
› Vacuum down to 2 mbar for reducing the num-
ber of voids in the solder joints
› Removes pores and voids immediately after the
soldering process reliably and vibration free
VisionXS
Convection soldering for Mid-Range applications
› Modular system concept
› Efficient heat transfer
› Stable process for lead-free applications
› Minimal downtime
› Integrated residue management
› User-friendly software tools for process monitoring
VisionXC
Convection soldering with compact design
› Optimized heat transfer and thermal stability
›
Excellent process performance at minimal space
›
Efcient residue management system for a clean
process chamber
VisionXP+
High-End convection soldering
›
Efficient reflow convection soldering process
at highest process stability
›
Industry 4.0 ready due to numerous software
tools
›
Flexible transport systems
›
Efficient residue management with pyrolysis
›
Highest energy efficiency with reflow soldering
The VisionX-Series
As individual as your production
Does your production environment need a compact system which can be adapted optimally to your requirements?
Do you process sensitive electronic components which need to correspond to certain temperature conditions? Or
would you like a system that can solder void-free under a vacuum? We have a diverse range of products!
4
Your production department can meet any re-
quirement using manufacturing equipment from
Rehm!
With the VisionXC, VisionXS and VisionXP+ we
offer different systems for optimum soldering
processes in the most diverse of manufacturing
environments. Different process zone lengths
are available depending on the type of system.
The pre-heating, peak and cooling zones have
the same pitch and therefore are constructed
in a modular design. Additional features such
as a vacuum unit for void-free soldering, double
pyrolysis for a better cleaning result or under-
side cooling for gentle processing of high-mass
boards are optionally available and can be added
to the system concept seamlessly.
Modular, exible system concept
Energy ecient system with lowest CO
2
emission
Highest process stability even with lead-free soldering
Minimum downtime and lowest maintenance effort
Excellent traceability due to smart software tools
Lowest „Total Cost of Ownership“
The right system for every application
Innovative solutions from Rehm
Save up
to 20 %
energy!
VisionX-Series | Modularity
5
Large batch sizes – frequent product changes?
We will nd the best system for you!
Requirements in the eld of reow soldering are as varied as the products produced on an SMD pro-
duction line. That is why we provide you with intensive guidance before the purchase decision as to
which system is the most ecient for the applications you require.
We take all relevant parameters into consideration in the process of this. Take for example the through-
put rate, this is one of the most important parameters for determining the optimum process zone
length. If frequent product changes and multi-shift operation are added to the equation, additional
options will be required that need also be taken into account. After clarifying all the process-relevant
parameters, you can rest assured that you will have a reflow soldering system adapted to all your
needs, one with which you can manufacture reliably and efciently. The diverse range of options within
the VisionX range means that we have the right system for every manufacturing environment.
nitrogen
operation
number of
peak zones
length of
heating zones
number of
cooling zones
number of
pre-heating zones
VXP+ nitro 3500 (Typ 734)
System varieties
using the example of VisionXP+ nitro:
TYPE
523
634
734
834
934
944
peak zones
pre-heating zones
cooling zones
Process zone Throughput
*
2450 mm 115 / h
3150 mm 130 / h
3500 mm 145 / h
3850 mm 160 / h
4200 mm 180 / h
4550 mm 200 / h
*
approximated values of a
PCB length of 300 mm and
a distance of 100 mm