KE2010.Instruction Manual.Ver.2.01,Rev.08 - 第147页

4 – 40 (4) BOC ty pe T o place a component more precisely , posit ioning m arks m ay be made on a board. Select a BOC type according to t he actual positioning mark setting . 1) Not used Product ion is carried out withou…

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(3) PWB configuration

1) Single PWB

The PWB which has only one circuit pattern.

Figure of the single pattern

2) Multiple PWB matrix

The PWB which has multiple circuit patterns aligned in depth and width and

with a same angle and space.

Figure of the Matrix multiple patterns

3) Multiple PWB non-matrix

The PWB which has multiple circuit patterns but with a different angle and

space among them.

Figure of the Non-matrix multiple patterns

Note that circuits are automatically assigned in the multiple PWB non-matrix

pattern if you change the PWB configuration from the multiple PWB matrix

pattern to the multiple PWB non-matrix pattern after setting the dimensions for

the multiple PWB matrix pattern. If you change the PWB configuration from the

multiple PWB matrix or multiple PWB non-matrix pattern to the single PWB

pattern, a PWB is configured as one circuit, and the confirmation message

appears on the screen.

Component

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(4) BOC type

To place a component more precisely, positioning marks may be made on a

board.

Select a BOC type according to the actual positioning mark setting.

1) Not used

Production is carried out without using the BOC mark. (The mark printed on

the PWB and to be used for offsetting the placement point.) See Sections

"1.1.7 Printed circuit board specifications" and 5 " Board Recognition Marks

2) PWB mark is used

A set of BOC marks are used for the placement point offset of the entire

PWB area. When the BOC mark is used for a single pattern PWB, select

this item. When a set of BOC marks is used for the entire area of a multi

pattern PWB, select also this item.

3) Circuit mark is used

For a multiple pattern PWB, when the BOC mark of each pattern is used for

the placement point offset of each circuit of the PWB, select this item.

Accuracy of placement is better compared with the placement using the BOC

mark but it takes longer to complete the recognition of all BOC marks.

For a non-matrix multiple pattern PWB, the circuit has to be assigned in 90,

180, 270, or 360 degrees against the reference circuit.

(5) Bad mark type

A bad mark may be made on a multiple pattern board so that no component can

be placed on a defective circuit. To use a bad mark, select the bad mark type

according to the difference of reflection ratio between a bad mark and a board.

1) Not used

Select this item when production is carried out without using bad marks.

(The bad marks are used for recognizing a certain circuit of a multiple pattern

PWB where components are not to be mounted. Normally, sealing or

painting is applied for the bad marks.) For a single pattern PWB, the bad

marks cannot be used, and select this item.

2) Mark is light

Select this item when a bad mark and the PWB are recognized with the bad

mark sensor, and the reflection ratio of the bad mark is higher than that of the

PWB.

3) Mark is dark

Select this item when a bad mark and the PWB are recognized with the bad

mark sensor, and the reflection ratio of the bad mark is lower than that of the

PWB. This item shall be selected particularly when black bad marks are

used on a ceramic board.

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(6) Scale type

1) Gray scale (Multi-level) recognition

Obtain the level distribution of the brightness of the marks in depth and width.

Then, calculate shape of the marks and positions of the centers. Because

mark recognition is performed using the data obtained from multiple marks,

precise recognition is possible. Normally, select this item.

2) Binary scale (Bi-level) recognition

Obtain the edges of the marks, and calculate shape of the marks and

positions of the centers. Select this item only for the marks those where

multi-level recognition is impossible.