KE2010.Instruction Manual.Ver.2.01,Rev.08 - 第33页

1 − 16 Note: For the shape of chip component s to be mounted (1) For the part s whose shape is cylindrical, there is no minimum shade when turned, and chip recognit ion by laser align is ther efor e impossible. (2) A poo…

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1.1.6 Applicable components and packages

(1) Applicable component sizes (For laser recognition)

Item Specifications

Component height specifications 6 mm

20 mm (option at the

factory)

Head Laser recognition (MNLA)

Min. 0.2 mm

Component height

Max. 6 mm

20 mm

Min. 0.6 mm x 0.3 mm

Component size

(Length x Width)

Max. 20 mm x 20 mm or 26.5 mm x 11 mm

(Diagonal line should be 30.7 mm or less.)

Lead pitch Min. 0.65 mm

(2) Applicable component

Table 1.1.6.1

Component Name Shape Package

Square chip resistor 0603, 1005, 1608, 2012, 3216, 3225 (5025, 6432)

Network resistor (Excluding SOP, SOJ, PLCC types)

MELF resistor 1.6 x φ1.0mm, 2.0 x φ1.25mm, 3.5 x φ1.4mm,

5.9 x φ2.2 mm

Laminated ceramic

capacitor

0603, 1005, 1608, 2012, 3216, 3225, 4532, 5750

(5632)

Tantalum chip capacitor 3216, 3528, 6032, 7343

6.0 mm or less Aluminum electrolytic

capacitor Height:

10.5 mm or less

(applicable if the component height specifications

is 20 mm.)

Chip film capacitor

Variable trimmer capacitor,

Chip potentiometer,

trimmer

Chip ferrite beads

Chip inductor

Tape

SOT molded part 1608/2012, SOT-23,

SOT-89, SOT-143, SOT-223

SOP 8, 14, 16, 18, 20, 24, 28,32-pin

SOJ 16, 18, 20, 24, 26, 28-pin

PLCC 18, 20, 22, 28 (Square), 28 (Rectangle),

32, 44-pins

QFP, BQFP Lead pitch: 0.65 mm or less □20mm or less

BGA

□

20mm or less

Connector

□

20mm or less with 0.65mm or less pitch,

Laser recognition must be possible.

IC socket □20mm or less with 0.65mm or more pitch,

Laser recognition must be possible.

Tape

Stick

Tray

Note:

Four nozzles can pick up components whose size is 10 mm x 10 mm

or less simultaneously.

Two nozzles (No. 1 and 3 or No. 2 and 4: one nozzle is skipped) can

pick up components whose size is larger than 10 mm x 10 mm

simultaneously.

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Note: For the shape of chip components to be mounted

(1) For the parts whose shape is cylindrical, there is no minimum shade when turned,

and chip recognition by laser align is therefore impossible.

(2) A poor pickup or placement accuracy could result if the top surface of the

component to be placed is curved, protruded, or dented. Avoid using such

components. (Some such components may, however, be handled by changing

the nozzle number.)

Pickup nozzle

Slotted groove

Embossed characters

Dented

Laser recognition

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1.1.7 Printed circuit board specifications

1. Board size

Min. : X 50 mm x Y 30 mm

Note that the minimum size becomes 50 mm x 50 mm (X/Y) (optional)

when the machine is equipped with the automatic PWB width

adjustment function.

Max. : [KE-2010M] X 330 mm x Y 250 mm

[KE-2010L] X 410 mm x Y 360 mm

[KE-2010E] X 510 mm x Y 460 mm

X : Along the movement of the board

Y : From front to rear (and reversely) of the machine

2. Board thickness

Min. : 0.4 mm

Max. : 4 mm

3. Board warp limit

0.2 mm or less per 50 mm

1 mm or less both for upward and downward directions

(Conforms to JIS B 8641.)

4. Board limitations

(1) Marginal area

Note: Dimension at the factory

Movement of PWB

Marginal area

Standard φ4

+0.1

φ2.5 - φ4

+0.1

mm (Optional)

[KE-2010M] 30 - 250mm

[KE-2010L] 30 - 360mm

[KE-2010E] 30 - 460mm

5 ± 0.1mm

5 - 7mm for particular ordering (factory-set)

Marginal area

Conveying rail (fixed)

Standard 5 ± 0.1mm (Note)

[KE-2010M] 50 - 330mm, [KE-2010L] 50 - 410mm, [KE-2010E] 50 -510mm