1OM-1603-006_w.pdf - 第187页

1OM-1603 0908-002 4-B

1OM-1603

1108-004 4-A

Chapter 4

Basic Information

This chapter describes the basic information.

 1. Specications

2. High-Speed Head Pick-up Component Size

(In the case that 15 components are to be picked up at

the same time).

3. Conditions for Component Placement

4. Fiducial Marks

5. List of Vacuum Nozzle Types

6. Measured Noise Value

1OM-1603

0908-002 4-B

1OM-1603

4-1

1.Specications:Chap.4

1108-006

1. Specications

1.1 SpecicationsofSIGMA-G5ChipMounter

Item Description

1. Model Name SIGMA-G5

2. Scope

This machine uses the double-sided operation system on the front and rear of

the machine and single PCB transfer method is used.

High-Speed Head Multi-Functional Head 3. Throughput

65,000 CPH / module

Note : The PCB transition time under

optimum conditions is

excluded.

Components : 14,500 CPH / 2 heads

Note : The PCB transition time under

optimum conditions is

excluded.

High-Speed Head Multi-Functional Head 4. Placement

Accuracy

0603 / 0402 : 40μm (3 σ) IC : 30μm (3 σ)

5. PCB

Transition Time

Approx. 2 seconds (PCB Length : 260 mm or less)

(Under Optimum Conditions)

6. PCB Flow

Direction and

Transfer Reference

PCB Flow Direction : From Left to Right/From Right to Left

(Selected when shipped from the factory)

Transfer Reference

: Rear Left/Rear Right/Front Left/Front Right

(Selected when shipped from the factory)

T1E1-1