1OM-1603-006_w.pdf - 第208页
1OM-1603 4-21 4. Fiducial Marks : Chap.4 (3) Material Copper Leaf, Ni Plating, Solder Plating, Solder Leveler, Au Plating Note (a) A copper leaf, a resist, a coating, a silk print, and a punched hole should not exist in …
1OM-1603
4-20
4. Fiducial Marks : Chap.4
Mark Type D1 [mm] D2 [mm] Remarks
r e k c e h C
) e l g n a t c e R (
0.5 to 3.0 0.5 to 3.0
• Mark Reference :
Contact of Two
Rectangles
e l o H h g u o r h T
) d n u o R (
0.5 to 3.0 0 to 2.8
• Mark Reference :
Center
• D2 :
Size of a punched
hole
• W : Min. 0.25 mm
k r a M d a P
) r a l u g n a t c e R (
0.5 to 3.0 0.5 to 3.0
• Mark Reference :
Center of Gravity
D1
2 D
D1
2 D
D1
2 D
D1
2 D
Or Or
( Front Side of Machine)
T1E4-2
Note
(a) The error of the mark size should be within ± 10% by comparison with the
reference pattern.
(b) A through hole or a pad mark should have only one land which is directed
in increments of 45°.
(2) SpecicationsofLineextendedfromaPadMarkoraThroughHole.
(See below)
80°
25
45°
Unit : mm
F1E13
1108-005
1OM-1603
4-21
4. Fiducial Marks : Chap.4
(3) Material
Copper Leaf, Ni Plating, Solder Plating, Solder Leveler, Au Plating
Note
(a) A copper leaf, a resist, a coating, a silk print, and a punched hole should not
exist in the range of 1.0 mm in both X and Y directions from the outermost
edges of a ducial mark. They may cause false recognition.
(Front Side of Machine)
1.0
X
Y
1.0
1.0
1.0
1.01.0
1.0
1.0
Example:
Unit : mm
F1E14
(b) The shape of PCB (a cutout, a punched hole), the external elements (light
reected from a structure, light emitted from an external device, etc.) may
sometimes interfere with the recognition of ducial marks.
(c) A ducial mark should make ample contrast with the surroundings. (To
prevent false recognition)
(d) Anything resembling a pattern similar to a ducial mark should not exist in
the designated window. If one exists, it may cause false recognition.
(e) A test may be required when the ducial mark cannot be recognized
because of the extreme warpage of the PCB.
1007-004
1OM-1603
4-22
5. List of Vacuum Nozzle Types : Chap.4
5. List of Vacuum Nozzle Types
The machine is equipped with nozzles designated in the delivery specications at
shipment.
Nozzle
Type
NO.
Shape
Note (a)
Component Size
(mm)
Note (b)
Applicable Components
for Reference
Remarks
Part No.
Part Name
HG22C
Stroke
I.D.
1.5
0.4 × 0.2
Thickness
0.2 to 0.3
0402-Type Resistors and
Capacitors
•
Nozzle for
Front Lighting
Recognition
•
Soft Mounting
Nozzle
HG22C---
NOZZLE_HG22C
HG32C
I.D.
0.4 × 0.2
0.7 × 0.4
Stroke
1.6
0.6 × 0.3
Thickness
0.2 to 0.3
0603-Type Resistors and
Capacitors
•
Nozzle for
Front Lighting
Recognition
•
Soft Mounting
Nozzle
HG32C---
NOZZLE_HG32C
HG52C
Stroke
I.D.
1.5
1.0 × 0.5 to
1.6 × 0.8
Thickness
0.2 to 0.3
1005-Type Resistors and
Capacitors
•
Nozzle for
Front Lighting
Recognition
•
Soft Mounting
Nozzle
HG52C---
NOZZLE_HG52C
HG82C
I.D.
1.6 × 0.8 to
2.0 × 1.25
Thickness
0.45 to 0.8
1608-Type Resistors and
Capacitors
•
Nozzle for
Front Lighting
Recognition
•
Soft Mounting
Nozzle
HG82C---
NOZZLE_HG82C
HV13C
I.D.
O.D.
2.0 × 1.25 to
3.2 × 2.5
Thickness
0.45 to 1.25
2012-Type Resistors,
Capacitors and
Super Mini-Transistors
•
Nozzle for
Front Lighting
Recognition
HV13C---
NOZZLE_HV13C
T1E5-1
1012-004
( )