SIPLACE D2 规格说明书英文版 - 第9页

9 Modular Machine Concept Sample Configuration BZ Buffer zone C & P Collect & Place head COT Component changeover table G1 Gantry 1 G2 Gantry 2 NCH C&P Nozzle changer for the C & P head OP Op erator pane …

Modular Machine Concept

Step 1: Placement system with 2 gantries

Step 2: Selection of the placement heads

12-nozzle C&P head

6-nozzle C&P head

Step 3: Selection of the conveyor

Single conveyor

Flexible dual conveyor

Step 4: Selection of the

component changeover table

Step 5: Selection of the feeder modules

S tape feeder modules

Modular Machine Concept

Sample Configuration

BZ Buffer zone

C&P Collect&Place head

COT Component changeover table

G1 Gantry 1

G2 Gantry 2

NCH

C&P

Nozzle changer for the C&P

head

OP Operator panel

PA Placement area

COT

NCH C&P

COT

C&P

OP OP

NCH C&P

C&P G2 G1

Head Modularity

Overview

The SIPLACE D2 is charac-

terized by maximum flexibil-

ity in the production process.

This flexibility is partly due to

the head modularity of the

placement machine as it

allows different placement

head variants to be config-

ured to suit the production

requirements.

The placement heads on the

D2 machines are configu-

rable:

• two 12-nozzle Collect &

Place heads or

• two 6-nozzle Collect &

Place heads or

• one 6-nozzle and one 12-

nozzle Collect&Place

head

Collect&Place principle

The SIPLACE 12 and 6-noz-

zle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 12 or 6

components are picked up

and "collected" by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the

nozzle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle.

Any deviations from the

required pick-up position

are corrected before

placement takes place.

• Force sensor

Monitors the specified

component set-down

forces. With the sensor

stop method, differences

in height during pick-up

and any unevenness of

the PCB surface are com-

pensated during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.

Collect&Place principle