ED-7306_E - 第11页

JEITA ED-7306 - 9 - Fig. 8 Recommended datasheet NOTE : The signs in the 3D plots and in the diagonal profile are opposite from the package warpage sign due to the dead bug position in the measurement. (150 ° C) (Preheat…

JEITA ED-7306

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7. Recommended datasheet for the package warpage

7.1 Measurement temperatures for data sheet

Typical measurement temperatures for datasheet are room temperature, melting point, peak temperature,

solidification point, and room temperature after cooling.

7.2 Datasheet

Datasheet is composed of

- temperature dependency of the package warpage (See Fig. 7),

- surface topography at each temperature in 3D plots (optional). (If the sign of warpage is opposite,

explanation is required; See Fig. 8),

- diagonal profile of the package at each temperature (optional). (If the sign of warpage is opposite,

explanation is required; See Fig. 8),

- explanatory figure of the sign of the package warpage (optional), and

- temperature profile for measurement.

7.3 Example of datasheets

Fig. 7 Temperature dependency of the package warpage

Average warpage

for xxxx & yyyy

-70

-60

-50

-40

-30

-20

-10

Warpage(um)

xxxxAVG

-17.8 -46 -55.7 -44 -47 -33.8 -18.3

yyyy

AVG

-21.5 -46.2 -58.7 -51.8 -48.5 -32 -21.8

25C 150C 220C 260C 220C 150C 25C

Sign

Warpage(µm)

-10

-20

-30

-40

-50

-60

-70

25°C 150°C 220°C 260°C 220°C 150°C 25°C

JEITA ED-7306

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Fig. 8 Recommended datasheet

NOTE: The signs in the 3D plots and in the

diagonal profile are opposite from the

package warpage sign due to the dead

bug position in the measurement.

(150°C)

(Preheat temperature)

(For reference)

220°C

Melting point

260°C

Peak temperature

220°C

Solidification point

(150°C)

(Tg of PWB)

(For reference)

Room temperature

JEITA ED-7306

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Explanation

This part of the document is not a specification but is intended for the explanation of the specification and

related issues.

1. Purpose of the establishment

In an environment marked by the higher-speed and miniaturizing trend of the electronic products, BGA

packages have been used in most of the electronic products thanks to the advantages of higher pin count

and compact body size features. Along with high volume usage of the BGA packages, analysis data of

soldering failures have accumulated and the package warpage at elevated temperature has been gaining

attention as a cause of these failures. This phenomenon is that the package warps during the rising

temperature of the reflow process and solder joints fail in an open or short mode, even if the package meets

the coplanarity requirement at room temperature.

Migration to thinner package body, finer pitch balls, and lead-free material has increased package warpage

during the reflow process and raised problems of open solder joints or solder bridges between balls. It is

known that the more a package is moisturized, the more the package warps. The Subcommittee reached

an agreement that the semiconductor suppliers shall specify the maximum permissible package warpages

at elevated temperature. It is similar to the package delamination specification at reflow stress. This

specification aimed at agreement of the common terms, unification of measurement methods, and

establishment of the criteria.

2. History of deliberation

In a past TSC had focused on the standardization of the dimensions of packages. The recent expansion of

the mission to the field of the package reliability has triggered the standardization activity on the package

warpage at elevated temperature, which has been requested by customers.

The standardization task force on the measurement method of the package warpage at elevated

temperature was formed on Jun. 23, 2005. The activity plan was to establish the standard of the package

warpage measurement by Apr. 2006 as phase 1 and the criteria of warpage by Dec. 2006 as phase 2. The

deliberation started from listing the factors that may affect the measurement methods and gathering

experimental data from the task force members. After the evaluation of the seriousness of the factors, the

specification was drafted. On the way of deliberation, the task force was informed the publication of “High

temperature package warpage measurement methodology”, JESD22B112, on Aug. 2005. The task force

discussed the measurement method based on this specification with the basic policy of maintaining

international harmonization.