西门子SIPLACE S25 HM-设备性能参数_EN - 第6页
4 Bare Board Loader SIPLACE SP-500 Screen Printer SIPLACE R N 26S Reflow Oven SIPLACE HS-50 SIPLACE S-25 HM Ma gazine Loader Example of a S IPLACE Placement L ine SIPLACE HS-50 Description Flexib ility a nd ad aptabi lit…
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Description
The high-speed SMD placement
system SIPLACE S-25 HM com-
bines high placement speed with
flexibility and accuracy. In contrast
to classic chipshooters, a Collect
& Place procedure is applied here.
SIPLACE S-25 HM placement ma-
chines are equipped with two X-/Y-
main gantries. Each gantry featu-
res a star-shaped Collect & Place
placement head with either 12
or 6 nozzles.
The placement heads alternately
pick up components from the sta-
tionary component feeder and
place components on the PCB
which is also motionless. This has
distinct advantages:
§ Component tapes of all sizes
can be replenished by splicing a
new reel of components to the
end of a depleting reel. This eli-
minates machine stoppage due
to component replenishment.
§ Stationary, vibration-free feed-
ers ensure a reliable pick-up of
even the smallest components
(e.g., 0201 and 0402 chips).
§ Thanks to the flexible Collect
& Place Heads – whose ideal
nozzle set-up is automatically
specified – the travel can be
minimized and the sequence of
placement optimally adjusted.
§ Populating a stationary PCB
also prevents components from
shifting during placement.
Speed coupled with economic ef-
ficiency and set-up reliability is the
SIPLACE S-25 HM recipe for suc-
cess. The first components are al-
ready being picked up while the
PCB is being moved in. While one
Collect & Place Head is placing
components, the other one is
picking components up.
The product capability is enhanced
by optional add-on features such
as component bar code scanner,
automatic nozzle changer or
changeover tables which can be
set up outside the machine and
exchanged in a matter of minutes.
§ Additional changeover tables
enables the reduction of job set-
up time increasing machine
utilisation.
§ Dual Conveyor eliminates the
non-productive PCB loading
times thus increasing machines
operating efficiency.
§ Automatic nozzle changers for
both changeover and storage of
nozzles.
§ PCB Barcode Reader used for
product controlled production
changeover.
§ Component Bar Code Scanner
used for feeder set-up verifica-
tion.
§ To achive the best placement
quality we recommend to order
an 0201 enhance kit.
§ Ceramic Substrat Centering
§ Matrix Tray Changer for high
speed IC-mounting
Machine Description
Technical Data
Type of placement head 12-Nozzle Collect & Place Head and/or
6-Nozzle Collect & Place Head
Number of gantries 2
Benchmark placement rate
a
12/12 25,000 cph
6/12 18,000 cph
6/6 17,000 cph
Component Range 0.6 x 0.3 mm
2
(0201) to 32 x 32 mm
2
Max. placement accuracy
(at 4 sigma)
a
90 µm (12-Nozzle Collect & Place Head)
80 µm (6-Nozzle Collect & Place Head)
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm
2
to 508 x 460 mm
2
/
2" x 2" to 20" x 18"
(optional up to 610 mm length)
50 x 50 mm
2
to 460 x 216 mm
2
/
2" x 2" to 18" x 8.5"
Feeding capacity 118 tracks, 8 mm tape
Component table Quick changeover table with integrated
wheels, reel holder and scrap bin,
SIPLACE MTC
Types of Feeder modules Tapes, Bulk Cases, Stick Magazines,
application-specific OEM feeders
Operating system Microsoft Windows / RMOS
Power 2 kW
Compr. air requirements 5.5 - 10 bar, 400 Nl/min, Tube ½"
a) As defined in “Scope of Service and Delivery SIPLACE”.
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Bare
Board
Loader
SIPLACE SP-500
Screen Printer
SIPLACE RN 26S
Reflow Oven
SIPLACE HS-50
SIPLACE S-25 HM
Magazine
Loader
Example of a SIPLACE Placement Line
SIPLACE HS-50
Description
Flexibility and adaptability charac-
terize the modular SIPLACE de-
sign. Each production line can be
individually composed of similar
and different modules.
Because of the small size and ro-
bust construction of the SIPLACE
modules, they can be recombined
quickly and easily to accommodate
changes in production require-
ments.
The SIPLACE family of placement
machines offers the right product
for each purpose – from the very
high-speed placement system
SIPLACE HS-50 to the high-speed
SMD placement system SIPLACE
S-25 HM and the flexible place-
ment system SIPLACE F
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HM.
SIPLACE line-level optimization
tools generate single set-ups for
single products, single set-ups for
several products as well as several
set-ups for several products. Also,
product programs can be trans-
ferred from line to line even when
the machine configurations are dif-
ferent.
Line Design
Technical Data
System SIPLACE SMD placement lines
Modules SIPLACE HS-50 / SIPLACE S-25 HM /
SIPLACE F
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HM
Peripherals Input/output station, screen printer,
solder oven, inspection conveyor etc.,
available from Siemens
PCB conveyor Automatic width adjustment
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm
2
to 368 x 460 mm
2
/
2" x 2" to 20" x 18"
50 x 50 mm
2
to 368 x 216 mm
2
/
2" x 2" to 18" x 8.5"
Ceramic substrate dimensions
(L x W)
50 x 50 mm
2
to 101.6 x 177.8 mm
2
2" x 2" to 4" x 7"
Placement speed Depends on layout of modules
Space required 4 m² / SIPLACE S & F modules
6.8 m² / SIPLACE HS module
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Description
Head Modularity allows the cus-
tomer to specify the machine head
configuration according to the
component range output require-
ments. The 6-Nozzle and the 12-
Nozzle Collect & Place Head can
be interchanged to accommodate
changing manufacturing require-
ments.
The X/Y-gantry features two
placement heads: the 6-Nozzle or
the 12-Nozzle high-speed Collect &
Place Head.
The possible configuration choices
are:
§ Two 12-Nozzle Collect & Place
Heads.
§ Two 6-Nozzle Collect & Place
Heads.
§ One 6-Nozzle Collect & Place
Head and one 12-Nozzle
Collect & Place Head.
Placement head configuration can
also be changed in the field by or-
dering the respective head recon-
figuration kit (head included) and
nozzle changer.
Exchanging the Collect & Place
Heads requires reconfiguration of
the station software and recalibra-
tion of the machine by trained per-
sonnel. Also – if used – the auto-
matic nozzle changer has to be
replaced to match the head used.
The reconfiguration will take about
8 hours with a trained service
technician.
Changing a placement head and
reconfiguring a SIPLACE machine
when and where required allows
the customer to benefit from the
flexibility of different placement
heads without having to invest in
several SIPLACE machines.
Placement Heads:
Head Modularity
Placement Heads for SIPLACE S-25 HM
6-Nozzle
Collect & Place
Head
12-Nozzle
Collect & Place
Head
Placement Principle of SIPLACE S-25
HM
➀ 6-Nozzle or 12-Nozzle
Collect & Place Head
➁ X-/Y-Gantry System
➂ Fixed Component Supply
➃ Fixed PCB