西门子SIPLACE S25 HM-设备性能参数_EN - 第8页

6 Placement Heads: Placement Accuracy Component Range Placement A ccuracy a Placement Head Placement Accurac y 12-Nozzle Collect & P lace Head 6-Nozzle Collect & P lace Head X/Y Accur acy 67.5 µm 60 µm 3 Sigma Ro…

Description

Head Modularity allows the cus-

tomer to specify the machine head

configuration according to the

component range output require-

ments. The 6-Nozzle and the 12-

Nozzle Collect & Place Head can

be interchanged to accommodate

changing manufacturing require-

ments.

The X/Y-gantry features two

placement heads: the 6-Nozzle or

the 12-Nozzle high-speed Collect &

Place Head.

The possible configuration choices

are:

§ Two 12-Nozzle Collect & Place

Heads.

§ Two 6-Nozzle Collect & Place

Heads.

§ One 6-Nozzle Collect & Place

Head and one 12-Nozzle

Collect & Place Head.

Placement head configuration can

also be changed in the field by or-

dering the respective head recon-

figuration kit (head included) and

nozzle changer.

Exchanging the Collect & Place

Heads requires reconfiguration of

the station software and recalibra-

tion of the machine by trained per-

sonnel. Also – if used – the auto-

matic nozzle changer has to be

replaced to match the head used.

The reconfiguration will take about

8 hours with a trained service

technician.

Changing a placement head and

reconfiguring a SIPLACE machine

when and where required allows

the customer to benefit from the

flexibility of different placement

heads without having to invest in

several SIPLACE machines.

Placement Heads:

Head Modularity

Placement Heads for SIPLACE S-25 HM

6-Nozzle

Collect & Place

Head

12-Nozzle

Collect & Place

Head

Placement Principle of SIPLACE S-25

➀ 6-Nozzle or 12-Nozzle

Collect & Place Head

➁ X-/Y-Gantry System

➂ Fixed Component Supply

➃ Fixed PCB

Placement Heads:

Placement Accuracy

Component Range

Placement Accuracy

Placement Head

Placement Accuracy

12-Nozzle

Collect & Place Head

6-Nozzle

Collect & Place Head

X/Y Accuracy 67.5 µm 60 µm

Sigma

Rot.-Accuracy 0.525° 0.225°

X/Y Accuracy 90.0 µm 80.0 µm

Sigma

Rot.-Accuracy 0.700° 0.400°

X/Y Accuracy 135.0 µm 120.0 µm

Sigma

Rot.-Accuracy 1.050° 0.450°

a) As defined in “Scope of Service and Delivery SIPLACE”.

Component Range

12-Nozzle

Collect & Place Head

6-Nozzle

Collect & Place Head

Component size

0.6 x 0.3 mm

18.7 x 18.7 mm

1.6 x 0.8 mm

32 x 32 mm

Max. component height 6 mm 8.5 mm

Max. component weight 2 gr 5 gr

Placement force 2.4 - 5.0 N 2.4 - 5.0 N

Performance See table on page 3 See table on page 3

Min. pitch lead / bump 500 / 350 µm 500 / 560 µm

Min. ball / bump diam. 200 µm 320 µm

b) 0201 (recommended to order the special 0201-kit).

12-Nozzle Collect & Place Head for High Speed Placement

Component Pick-Up/

Placement

Segment

Removal

Point

Turning to

the Placement

Position

Component

Vision

Description

The 12-Nozzle placement head

operates on the Collect & Place

principle. In contrast to classic chip

shooters, the 12 vacuum nozzles

of the SIPLACE Collect & Place

head rotate around a horizontal

axis. This does not only save

space:

Due to the small diameter com-

pared to chip shooters, the cen-

trifugal forces are significantly

lower. The results are high-speed,

reliable placement and the same

cycle time for all components.

Components are picked up and

placed reliably with the aid of vac-

uum followed by a gentle air kiss.

A number of vacuum tests moni-

tors if the component has been

picked up and placed accurately.

Various control and self-learning

functions further enhance the de-

pendability of the system:

§ The optical recognition of feeder

positions records the exact posi-

tion of the feeder table.

§ A camera on the placement head

(component vision module) de-

termines the exact position of

each component on the nozzle.

§ For every feeder the pick-up

offsets are averaged over the

last ten pick-ups. This enables

the head to dial-in on the pre-

cise pick point for each compo-

nent.

§ In addition, the package form is

also checked. If the actual geo-

metric dimensions of the com-

ponent do not correspond to

those programmed, the compo-

nent is rejected.

§ Components rejected by the vi-

sion system are dumped into a

bin, reject feeder or matrix tray.

Any rejected component gets

automatically placed during a

repair run.

§ Warpage of the PCB is accom-

modated by sensor stop acti-

vated z-axis placement. The sys-

tem also keeps the last ten

positions of the z-axis at com-

ponent placement and uses the

average of these values to im-

prove the drive down and place

speed of the cycle.

Placement Heads:

12-Nozzle Collect & Place Head for High Speed

Component Placement

Technical Data

Component range See table on page 6

Stroke of Z-axis max. 16 mm

Programmable placement force 2.4 to 5.0 N

Benchmark placement rate 12,500 cph (see also table on page 3)

Placement accuracy See table on page 6