DRAGF-THT-NX-UK_W - 第2页
Fol low ing th e w inn ing ph ilo sop hy whi ch cha rac ter ize d i ts bus ine ss in tes tin g o ver th ree de cad es, ba sed on th e con sta nt and ra pid in nov ati on of its te sti ng sol uti ons , S eic a i ntr odu c…
Following the winning philosophy which characterized its business in testing over three decades, based on the
constant and rapid innovation of its testing solutions, Seica introduces the
Dragonfly
T H T
NEXT>SERIES. This is the new generation of systems featuring a renovated and sleek look thanks to the
premium materials of the chassis and innovative worth discovering performances.
The automatic inspection
Dragonfly
T H T
NEXT>SERIES ensures a quick and complete
examination of all joints that may be brazed, soldered or even press fitted together.
The combination of multi-colored LED lighting and color scan camera
offers a deep inspection of the solder joint meniscus and the shorts
detection, while the full scan acquisition of the PCB surface and not only of
the components allows the solder balls detection.
Compared to manual inspection, the results of
Dragonfly
T H T
NEXT>SERIES are operator free, but always act objectives and
reproducible. The inspection allows rapid feedback of process faults
(closed-loop).
The test results are displayed for
documented repair of the module
on the appropriate repair
stations. This results in time and
cost savings as well as a
significant increase in quality.
THT SOLDER INSPECTION
Dragonfly
THT
NEXT>SERIES
The process of PCB assembly has undergone a fundamental change in recent years. The conventional through-hole
mounting technology has been increasingly replaced by the SMD technology, however the electronics industry cannot
completely eliminate THT technology.
In particular, components that are exposed to high mechanical loads, such as relays, coils, capacitors and power strips
are soldered with modern selective soldering or the established scale wave soldering methods.
PROCESS OPTIMIZATION
The first-pass yield of soldering is
typically much lower than in the
reflow process.
Typical errors are, for example,
open solder joints, solder bridges
and solder bumps. High quality
and reliability standards require
test and inspection tools that not
only provide all the information for
a repair facility, but also allow an
optimization of the process.
Even with large-scale tests and
changing products, a check within
the production cycle must take
place in order to achieve a high
productivity.
The
Dragonfly
T H T
NEXT>SERIES line has all
of the capabilities needed for implementation in any Factory 4.0
scenario, providing the possibility to plug in any proprietary or
third party information system to achieve the desired goals.
All the
Dragonfly
T H T
NEXT>SERIES testers
feature the
Industrial Monitoring solution “4.0 ready” by Seica, to
monitor current absorption, supply voltage, temperature, light
indicators and other parameters useful to indicate the correct
operation, to ensure predictive maintenance and make the
systems compatible with the new standards of the fourth industrial
revolution ongoing nowadays.
INDUSTRY 4.0
Information, and the technology needed to collect
and analyze data to obtain it, is key to the successful
digitalization of the manufacturing process, which is at the
heart of the Industry 4.0 concept.