SM471_Administrators_Guide(Chi_Ver1) - 第13页
本说明书的构成 3 7.1.1. 共同 Align Data .................................. ............................................... 7 - 20 7.1.2. CHIP 部品数据的设定 ........................................................ ............... 7 - 33…
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Samsung Component Placer SM471 Administrator
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s Guide
3.7. 退出 （Exit） .................................................................................................. 3 - 18
第 4 章 .Tools 简化操作 (shortcut) 菜单 ................................................................... 4 - 1
4.1. 初始化 (Return To Origin) ............................................................................... 4 - 1
4.2. 查看 SMVision 显示窗 ..................................................................................... 4 - 2
4.2.1. SMVision 构造 .................................................................................... 4 - 2
4.3. ANC 设定 ....................................................................................................... 4 - 7
4.4. 操作模式切换 (Operation Mode Change) .................................................... 4 - 10
4.5. 传送部分 (Conveyor) .................................................................................... 4 - 10
4.5.1. PCB 进入 / 输出 功能 ....................................................................... 4 - 11
4.5.2. Manual Control 功能 ......................................................................... 4 - 12
4.6. 当前位置 ....................................................................................................... 4 - 15
4.7. Manual Tool .................................................................................................. 4 - 17
4.8. Dump Imformation(Place Error Information) ................................................ 4 - 17
4.9. 抛掉所有零件 (Part Dump All) ..................................................................... 4 - 18
4.10. 飞达车 (Docking Cart) .................................................................................. 4 - 18
4.11. PM Manager ................................................................................................. 4 - 18
4.12. 数据记录 (Data Logging) ............................................................................... 4 - 18
4.12.1. 监控 .................................................................................................. 4 - 19
4.12.2. FileLoad ............................................................................................ 4 - 19
4.12.3. RebootRT ......................................................................................... 4 - 20
4.12.4. Mean TimeLog ................................................................................. 4 - 20
第 5 章 . Help 简化操作 (shortcut) 菜单 ..................................................................... 5 - 1
5.1. 语言 (Language) .............................................................................................. 5 - 1
5.2. 信息 (About ) .................................................................................................. 5 - 1
5.3. 帮助 (Help) ..................................................................................................... 5 - 2
Programming Reference
第 6 章 . Board 定义 ..................................................................................................... 6 - 1
6.1. 基本设定 (Basic Setup) ................................................................................... 6 - 1
6.2. Array PCB 设定 ............................................................................................... 6 - 9
6.3. 基准符号 (Fiducial Mark) 设定 ....................................................................... 6 - 16
6.3.1. 基准标设置顺序 ................................................................................ 6 - 24
6.4. Bad Mark 设定 ............................................................................................... 6 - 26
6.5. 接受标记 (Accept Mark) 设置 ......................................................................... 6 - 32
6.6. 2D Barcode ................................................................................................... 6 - 35
6.6.1. 环境设置 ........................................................................................... 6 - 35
6.6.2. Barcode Position .............................................................................. 6 - 36
6.6.3. Manual 2D Barcode Confirm 对话框 ................................................ 6 - 40
6.7. Block PCB ..................................................................................................... 6 - 43
第 7 章 . 元件的登记 ..................................................................................................... 7 - 1
7.1. 新部件的登记 ................................................................................................... 7 - 6
本说明书的构成
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7.1.1. 共同 Align Data ................................................................................. 7 - 20
7.1.2. CHIP 部品数据的设定 ....................................................................... 7 - 33
7.1.3. IC 部品的数据设定 ............................................................................ 7 - 45
7.1.4. User IC 部品的数据设定 .................................................................... 7 - 51
7.1.5. Hemt 部品的数据设定 ....................................................................... 7 - 63
7.1.6. Connector 部品的数据设定 ............................................................... 7 - 63
7.1.7. BGA 部品的数据设定 ........................................................................ 7 - 63
7.1.8. FLIP CHIP 部品的数据设定 ............................................................... 7 - 69
第 8 章 . 供应装置的设置 .............................................................................................. 8 - 1
8.1. 喂料器 （Feeder） [F4] .................................................................................... 8 - 1
8.1.1. 喂料器基座 （Feeder Base） ............................................................. 8 - 1
8.1.2. 杆式 （Stick Unit） ........................................................................... 8 - 12
8.1.3. 盘状喂料器 （Tray Feeder） ............................................................. 8 - 18
第 9 章 . Step Programming ........................................................................................ 9 - 1
第 10 章 . Optimization ................................................................................................. 10 - 1
10.1. Tape Feeder .................................................................................................. 10 - 1
10.2. Nozzle ............................................................................................................ 10 - 3
10.3. Feeder Lane ................................................................................................... 10 - 5
10.4. Parameter ...................................................................................................... 10 - 6
10.5. 优化器 (Optimizer) 的执行 .............................................................................. 10 - 9
10.6. Optimizer Dialog .......................................................................................... 10 - 10
10.7. Optimization Result ...................................................................................... 10 - 12
第 11 章 . Production Setup ......................................................................................... 11 - 1
11.1. Product Main .................................................................................................. 11 - 1
11.1.1. Product Monitor ................................................................................. 11 - 1
11.1.2. .................................................. 运行设定 11 - 7
11.1.3. 带式喂料器监控 ............................................................................... 11 - 11
11.1.4. 我的 PCB ......................................................................................... 11 - 15
11.2. 开始 （Start） [F2] ...................................................................................... 11 - 16
11.3. 停止 （Stop） [F3] ....................................................................................... 11 - 16
11.4. 继续生产 （Cont.） [F4] .............................................................................. 11 - 16
11.5. 完成 （Finish） [F5] .................................................................................... 11 - 17
11.6. T/F 数量 [F6] ................................................................................................ 11 - 17
11.7. PCB 下载 [F7] .............................................................................................. 11 - 19
11.8. 生产数据 [F8] ............................................................................................... 11 - 19
Calibration & Setup
第 12 章 . Machine Calibration .................................................................................... 12 - 1
12.1. Head [F2] ....................................................................................................... 12 - 1
12.1.1. Head TAP 对话框 .............................................................................. 12 - 1
12.1.2. < 朝向偏移 > TAP 对话框 .................................................................. 12 - 3
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Samsung Component Placer SM471 Administrator
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s Guide
12.1.3. <R 轴 > TAP 对话框 ......................................................................... 12 - 5
12.1.4. < 飞行固定偏移 > TAP 对话框 .......................................................... 12 - 6
12.1.5. < 计数偏移 > TAP 对话框 ................................................................. 12 - 7
12.2. 摄像机 （Camera） [F5] ................................................................................ 12 - 9
12.3. 校正 [F9] ...................................................................................................... 12 - 12
12.3.1. 原点刻度 ......................................................................................... 12 - 13
12.3.2. 歪斜修正 ......................................................................................... 12 - 16
12.3.3. 基准照相机测量 .............................................................................. 12 - 18
12.3.4. Common XY Calibration ................................................................. 12 - 21
12.3.5. Conveyor Calibration ...................................................................... 12 - 24
12.3.6. X-XY Compensation ....................................................................... 12 - 32
12.3.7. Gantry Thermal Mapping ................................................................ 12 - 33
12.3.8. Gantry Mapping .............................................................................. 12 - 36
12.3.9. ANC Pos. Scan .............................................................................. 12 - 40
12.3.10.Head & Camera Calibration ........................................................... 12 - 40
12.3.11.Board Positon Calibration ............................................................... 12 - 77
第 13 章 . 系统设置 ....................................................................................................... 13 - 1
13.1. 传达装置 (Conveyor) [F3] .............................................................................. 13 - 1
13.2. Position [F4] .................................................................................................. 13 - 7
13.2.1. < 进给基础 > TAP 对话框 ................................................................. 13 - 7
13.2.2. <Dump Box> TAP 对话框 ................................................................. 13 - 9
13.3. 外围设备 (Peripherals) [F6] ......................................................................... 13 - 11
13.3.1. <Dump Box> TAP 对话框 ............................................................... 13 - 11
13.3.2. <Tray Feeder> TAP 对话框 ........................................................... 13 - 13
13.4. Light [F8] ..................................................................................................... 13 - 14
13.5. Pref. [F10] .................................................................................................... 13 - 14
13.5.1. < 一般 > TAP 对话框 ...................................................................... 13 - 15
13.5.2. < 信号 > TAP 对话框 ...................................................................... 13 - 21
13.5.3. <Device> TAP 对话框 .................................................................... 13 - 24
13.5.4. <SECS> TAP 对话框 ...................................................................... 13 - 25
13.6. 装置 （Device） [F11] .................................................................................. 13 - 27
13.6.1. Tape Feeder ................................................................................... 13 - 27
13.6.2. Stick Feeder ................................................................................... 13 - 28
13.6.3. Tray Feeder .................................................................................... 13 - 29
13.6.4. Nozzle ............................................................................................ 13 - 30
Diagnosis & Utility & 生产信息管理
第 14 章 . Diagnosis( 诊断 ) ......................................................................................... 14 - 1
14.1. 输入 / 输出 （I/O） [F2] .................................................................................. 14 - 2
14.2. 传输装置 （Conveyor） [F3] .......................................................................... 14 - 4
14.3. 灯光 （Light） [F4] ......................................................................................... 14 - 5