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SIPLACE HS-50 2 Retrofitting Instructions: Mechanical Ceramic Subs trate Centering HS-50 01/01 Issue 2.1 Overview 65  5HWURILWWLQJ,QVWUXFWLRQV 0HFKDQLFDO &HUDPLF6XEVWUDWH&HQWHULQJ+6   2 Y HU Y LHZ …

1 Nachrüstanleitung: Mechanische Keramiksubstrat-Zentrierung HS-50 SIPLACE HS-50

1.9 Anhang: Kabel und Schaltpläne Ausgabe 01/01

SIPLACE HS-50 2 Retrofitting Instructions: Mechanical Ceramic Substrate Centering HS-50

01/01 Issue 2.1 Overview

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These instructions describe how to retrofit the optional "mechanical ceramic substrate centering

unit HS-50". Only the Siemens SMD service engineer is permitted to perform retrofitting.

– Note the following prior to the retrofitting:

– The optional "mechanical ceramic substrate centering unit of the HS-50" is always installed

in both of the conveyor’s processing areas. In the case of a dual conveyor, it is generally

also installed in both PCB conveyors.

The retrofit kit for the ceramic substrate centering unit HS-50 contains

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of the HS-50!

– If older HS-50 machines are involved, the 2 fastening and centering holes used to install

the mechanical substrate centering unit may not have been made in the plate of the lifting

table. This must be clarified with the customer prior to the retrofitting so that the proper num-

ber of

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(with holes) are taken along and the time required for retro-

fitting can be scheduled.

– If the conveyor control TSP 100 has been installed on the HS-50 placement machine, it is

upgraded to the new status of the TSP 200 at the same time that the mechanical ceramic

substrate centering unit is retrofitted.

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for TSP 200 is used for this pur-

pose (see Section 2.3, "Requirements").

The time expended for this must be included in calculation when planning the retrofitting.

– Insofar the electrical connection ist concerned, different situations exist for the retrofitting of

mechanical ceramic substrate centering unit

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as described in detail in Section 2.5.11 and

Section 2.5.12:

– Connection to the conversion board ("piggyback board") of the conveyor control

"changeover handling of TSP 200" in the machine frame.

– Connection to the conversion board (in the PCB conveyor area) of the conveyor control "se-

ries handling of TSP 200".

– The solenoid valve (for each processing area) is installed in the longitudinal cable pit on the

fixed conveyor side. The pneumatic hose of the relevant ceramic substrate centering unit is

connected via the Y-hose connection in the compressed air branch of the stopper (5.6 bar).

2 Retrofitting Instructions: Mechanical Ceramic Substrate Centering HS-50 SIPLACE HS-50

2.1 Overview 01/01 Issue

– The conveyor assemblies are converted for use of the mechanical ceramic substrate centering

unit (X-centering unit) by installing the holddowns from the retrofit kits.

– The appropriate stop rail and the appropriate stop unit (kit 1, 2 or 3) are mounted on the X-

centering unit to adapt it to the substrate size to be processed: 50 mm to 140 mm. These parts

are available, preassembled, in the retrofit kit (see Section 2.4 and Section 2.5.9).

NOTE:

On request, it is possible to perform a retrofit kit for the "mechanical ceramic substrate centering

unit HS-50" for machines HS-50 with optinal "PCB conveyor, left".

This retrofitting is not described here but can be executed in a like manner.

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