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SIPLACE S-25 HM 2 Assembly Instructions: Component Sensor (Option) for RV12-DLM1 Placement Head 04/2007 Edition 2.3 Overview of Assembly 27 2.3 Overview of Assembly Only the service engin eer from Siemens AG is permitted…
2 Assembly Instructions: Component Sensor (Option) for RV12-DLM1 Placement Head SIPLACE S-25 HM
2.2 Necessary firmware for component sensor at DLM placement head 04/2007 Edition
26
NOTE:
The component sensor is equipped with a temperature compensation circuit. This ensures uni-
form signals - within the temperature erection conditions for SIPLACE. 2
2.2 Necessary firmware for component sensor at DLM
placement head
2
2
2
2
2
2
2
SW versions Affected machines
Head firmware versions
505.03
S-25 HM / S-27 HM / HS-50
BIOS: 01.04 K0400104
505.04
HF / HF3
Appl.: 06.14 K0410614
601.03 SP2
X-series X-series:
BIOS: 03.CF K06003CF
Appl.: 02.10 K0610210
D-series:
BIOS: 03.CF K07003CF
Appl.: 01.18 K0710118
602.xx
D4, D3, X-series
603.xx
X-Serie, D-series
SIPLACE S-25 HM 2 Assembly Instructions: Component Sensor (Option) for RV12-DLM1 Placement Head
04/2007 Edition 2.3 Overview of Assembly
27
2.3 Overview of Assembly
Only the service engineer from Siemens AG is permitted to perform the assembly. 2
2.3.1 Scope of Work
If the machine to be assemblied does not have a "modular head PCB" yet, it must first be assem-
blied on all gantries of the machine. You will find the item number of the pertinent assembly kit,
including the assembly instructions, in Abschn. 2.5.4.
NOTE:
The option can be installed on one, several or all of the machine’s DLM1 placement heads on
S-25 HM / HS-50. 2
2.3.1.1 Work Steps in Brief:
– Move placement head into the setup position (function of the operator interface).
– Undock/move out the mobile changeover table.
– If present, fold down the head crash protection unit and move placement head forward into a
convenient working position.
– Undo the screws fastening the blast air unit.
– Install the component sensor with the aid of the assembling gauge.
– Lay the component sensor cable, connect to modular head PCB, and fasten it such that strain
is relieved.
– Set up 0201 and 0402 components on the mobile changeover table to be moved into place.
– Position the placement head over the PCB conveyor. Move the mobile changeover table in and
dock it with correct allocation to the machine. Fold down the head crash protection unit.
– If the machine to be assemblied is equipped with software version 502.xx:
Read the SW V 503.xx into the station and line computer (or SW SIPLACE PRO 1.3 for LC).
– Perform all further work steps for the component sensor on the station, the line computer and
the station computer as described in the manual for 0201 placement.
– Conduct trial placement with 0201/ 0402 components.
2 Assembly Instructions: Component Sensor (Option) for RV12-DLM1 Placement Head SIPLACE S-25 HM
2.3 Overview of Assembly 04/2007 Edition
28
2.3.2 Prerequisites for Assembly
– Platform 2 (S-25 HM / HS-50)
– 12-DLM1 placement head
– Optional "modular head PCB" (is always assemblied on all gantries).
– Line computer software: line computer UNIX SW version 5.03.xx or later or SIPLACE PRO 1.3
– Station computer software HS-50 or S-25 HM: SW version 5.03.xx or later
NOTE:
Before assembling, find out what the machine is equipped with. 2
2.3.3 Required Time
-
Assembling the modular head PCB, PER placement head
Mechanical work + track signals + firmware download for head PCB approx. 1.5 hrs.
(of which, 0.5 hrs per placement head are for mechanical work)
- Assembling the component sensor, PER placement head:
Complete sequence, including trial placement approx.1.5 hrs.
(of which, 0.5 hrs per placement head are for mechanical work)
- Installation of SW V 503.xx on line computer and station computer approx. 3.0 hrs.
NOTE:
The modular head PCB must always be assemblied on ALL gantries (placement heads). 2