CM602规格说明书（英文） - 第24页
CM602-L 2006.0515 - 19 - ■ Nozzle for chip components / QFP ∗ The product num ber s hould be us ed f or order p lacem ents. (Unit: mm ) Nozzle N o. 1403 1479 1514 Product number KXFX0556A00 KX FX05ASA00 KXFX05G9A00 Nozzl…
CM602-L 2006.0515
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■
Nozzle for Connector (3/3)
∗
The product number should be used for order placements. (Unit: mm)
Nozzle No. 1252 1272 1333
Product number
KXFX04XEA00 KXFX04YKA00 KXFX051JA00
Nozzle unit
shape
(Unit: mm)
Max. component
height
18.5 mm 21 mm 18.5 mm
Remarks Nozzle length: 27.5 mm Nozzle length: 22.5 mm Nozzle length: 27.5 mm
Nozzle No. 1404 1421 1528
Product number
KXFX0558A00 KXFX056AA00 KXFX05GZA00
Nozzle unit
shape
(Unit: mm)
Max. component
height
21 mm 21 mm 18.5 mm
Remarks
With a urethane rubber
Nozzle length: 22.5 mm
With a urethane rubber
Nozzle length: 22.5 mm
Nozzle length: 27.5 mm
Nozzle No. 1656 2405 2437
Product number
KXFX05MXA00 KXFX05BVA00 KXFX05DRA00
Nozzle unit
shape
(Unit: mm)
Max. component
height
21 mm 21 mm 21 mm
Remarks Nozzle length: 22.5 mm
With a urethane rubber
Nozzle length: 22.5 mm
With a urethane rubber
Nozzle length: 22.5 mm
φ
6
4
1.4
1
φ
2.7
2.1
1.2
0.6
φ
20
18
1
1.
8
4.5
3
Urethane
rubber
φ
10
8
2
4
φ
1.2
φ
1.6
φ
3
4.5
φ
12
11
1.8
1
Urethane
rubber
φ
5
1
2
3
Urethane
rubber
5
1.4
3
φ
7
Urethane rubber
φ
20
18
1.5
3
CM602-L 2006.0515
- 19 -
■
Nozzle for chip components / QFP
∗
The product number should be used for order placements. (Unit: mm)
Nozzle No. 1403 1479 1514
Product number
KXFX0556A00 KXFX05ASA00 KXFX05G9A00
Nozzle unit
shape
(Unit: mm)
Target
component
QFP QFP Volume
Max. component
height
21 mm 18.5 mm 21 mm
Remarks
With a urethane pad
Nozzle length: 22.5 mm
With a urethane rubber
Nozzle length: 27.5 mm
Nozzle length: 22.5 mm
Nozzle No. 1518 1580 1604
Product number
KXFX05GHA00 KXFX05KRA00 KXFX05L9A00
Nozzle unit
shape
(Unit: mm)
Target
component
Terminal LED
Melf
Φ
2.2
∼
Φ
2.5
Max. component
height
21 mm 21 mm 21 mm
Remarks Nozzle length: 22.5 mm Nozzle length: 22.5 mm Nozzle length: 22.5 mm
■
Correspondence between the pickup depth of electronic component and the nozzle length
The necessary nozzle length varies according to the pickup depth (distance from top of embossed tape to
pickup surface) of electronic component to be placed.
Pickup
depth B
0 mm
to below 3 mm
3 mm
to below 8 mm
8 mm
to below 13 mm
Nozzle
length A
22.5 mm 27.5 mm 32.5 mm
Pad
φ
6
φ
6
Urethane
rubber
φ
5
φ
3
φ
1.2
φ
2.5
φ
2
φ
2.5
φ
3
3.1
φ
0.9
φ
1.2
R1.25
φ
1.6
φ
2.2
φ
3
Emboss tape
Component
Nozzle
length A
Pickup
depth B
CM602-L 2006.0515
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4.3 Recognition Unit Configuration
■
Line Camera
The position in picking up the chip and the angle deviation are corrected with the image of line camera.
In addition, the presence of solder bumps can be detected
(*)
for BGA/CSP through the side lighting (option).
* There are limitations on the chips for which the bump detecting feature is available.
Please see the items describing the recognition condition of BGA.
Recognition
method
Recognition
speed
Applicable Component
Low
Components with leads of 0.5 mm or less pitch, and CSP.
Middle
BGA and 0603 (0201”) chip.
Chip with leads of the pitch between 0.5 mm and 0.8 mm.
Batch
recognition
High
General chip components including the square chips measuring 1005
(0402”) or over.
■
Lead Checker (Option)
Floating leads are detected by laser scanning all the leads of SOP, QFP, etc. whose size is 50 mm × 50 mm
or less.
・
Measurable range of the floating lead is up to ±0.75 mm.
・
Lead opening must be 0.2 mm or over to be detected.
・
Lower plane of the lead must be 0.2 mm or over to be detected.
・
Some leads cannot be laser scanned depending on the state of the leads’ bottom.
So please consult us before adopting this option.
■
PCB Recognition Camera
・
Visual field: 5 mm × 5 mm
(For information about the dimensions of PCB recognition mark, see “6. PCB Design Standards.”)
Lead checke
r
Laser light
Opening is 0.2 mm or over.
Lower plane of the lead is 0.2 mm or over.