00197674-01-UM-E-Series-EN-12-2014 - 第128页
3 Technical data and assemblies User manual SIPLACE E 3.5 Placement head From software version SC 708.0 12/2014 Editio n 128 3.5.5 SIPLACE TH for hi gh precision IC placement Item no. 030336 29-xx SIPLACE TH Item no. 031…
User manual SIPLACE E 3 Technical data and assemblies
From software version SC 708.0 12/2014 Edition 3.5 Placement head
127
3.5.4.1 Safety instructions
3
3
WARNING
Please observe the warning label section 2.2.5, page 58.
WARNING
Please observe the safety instructions of the vacuum pump in the user manual sup-
plied.
3 Technical data and assemblies User manual SIPLACE E
3.5 Placement head From software version SC 708.0 12/2014 Edition
128
3.5.5 SIPLACE TH for high precision IC placement
Item no. 03033629-xx SIPLACE TH
Item no. 03112312-xx Stationary component camera, type 36 GigE
3
Fig. 3.5 - 8 SIPLACE TH for high precision IC placement
(1) Pick&Place module 1 (PP1) - the SIPLACE TH consists of 2 Pick&Place modules
(2) Pick&Place module 2 (PP2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
User manual SIPLACE E 3 Technical data and assemblies
From software version SC 708.0 12/2014 Edition 3.5 Placement head
129
3.5.5.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The SIPLACE TH is suitable for process-
ing complex and large components. Two components are picked up by the placement head,
optically centered on the way to the placement position and rotated into the necessary placement
angle. They are then placed gently and accurately onto the PCB with a controlled blast of air.
The nozzles of type 5xx/5xxx have been developed for the SIPLACE TH. With an adapter you can
also use the nozzles of type 4xx, 8xx and 9xx.