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What is touchless placement of components? Prerequisites 26 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1)

What is touchless placement of components?

Prerequisites

Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 25

2 What is touchless placement of components?

What is touchless placement of components?

For the placement of highly sensitive components in the chip assembly process, placement without con-

tact can be carried out. For a "touchless" component placement, the placement process Touchless must

be assigned to the component shape. At least three height measurement points must be available on

the boards or grid boards onto which the components are to be placed. The Z height is measured from

the level of these height measurement points.

This process is designed for highly sensitive components and can only be used for boards with high lev-

els of planarity (e.g. with chuck or vacuum tooling).

2.1

2.1 Prerequisites

Prerequisites

▪ SIPLACE Pro version 14.1 or higher

▪ Station software version 710.1 or higher

▪ Planarity of the board for placement (< 20µm)

– Board transport with chuck / vacuum tooling is recommended

▪ Constant component thickness

▪ For C&P 20 A/M/P/M2 placement head

What is touchless placement of components?

Prerequisites

26 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1)

Programming in SIPLACE Pro

Component Shape with Placement Process "Touchless"

Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 27

3 Programming in SIPLACE Pro

Programming in SIPLACE Pro

3.1

3.1 Component Shape with Placement Process "Touchless"

Component Shape with Placement Process "Touchless"

In order to place components "Touchless", the placement process Touchless must be assigned to the

component shape.

► In the Component Shape Editor in SIPLACE Pro, open the required component shape (1).

Component Shape Editor – Assigning a Placement Process

► Under Placement Process, select Touchless (2).

⇨ All components which are assigned to this component shape will be placed on the boards by means

of the Touchless placement process.

⇨ Under Placement on the Handling tab in the Component Shape Editor, the value for the Standard

force is set to 0.

⇨ At least three height measurement points must be available on the boards or grid boards to be

placed. See also "3.2 Defining Height Measurement Points" [ ➙ 29].