IPC-T-50F_ - 第93页
24.0420 Ef fective Color T emperature 24.0421 Ef fective Focal Length 24.0633 Illuminance 24.0634 Illumination 24.1791 Individual T est Pattern (IDP) 24.0727 Luminance 24.0728 Luminous Energy 24.0729 Luminous Flux 24.074…
22.0462 External Layer
22.0488 Feature
22.0493 Fiducial Mark
22.0505 Fingers
22.0537 Flush Conductor
22.0548 Footprint
22.0549 Form
22.0559 Gauge Precision
22.0568 Geometric Tolerance
22.1812 Grid
22.1414 Ground Plane Clearance
22.0595 Heatsink Plane
22.0610 Hole Density
22.0611 Hole Location
22.1621 Hole Pattern
22.0639 Independent of Size
22.0640 Index Edge
22.0641 Index Edge Marker
22.0642 Indexing Hole
22.0643 Indexing Notch
22.0644 Indexing Slot
22.1427 Innerlayer Connection
22.0654 Interfacial Connection
22.1614 Interlayer Connection
22.0658 Internal Layer
22.0659 Interstitial Via
22.1432 Keying Slot
22.1622 Land
22.0678 Land Pattern
22.0677 Landless Hole
22.1624 Layer
22.0686 Layer-to-Layer Spacing
22.0695 Lead Mounting Hole
22.0701 Least Material Condition (LMC)
22.1439 Legend
22.0745 Master Line
22.0747 Maximum Material Condition (MMC)
22.1756 Metalized Land Areas
22.0766 Minimum Annular Ring
22.0765 Minimum Annular Width
22.1184 Nonconductive Pattern
22.1453 Nonfunctional Interfacial Connection
22.1185 Nonfunctional Land
22.1186 Nonfunctional Terminal Area
22.0805 Offset Land
22.0806 Offset Terminal Area
22.0828 Parallel Pair
22.0862 Pilot Hole
22.1473 Pitch
22.1475 Plated-Through Hole (PTH)
22.0882 Polarizing Slot
22.0887 Positional Tolerance
22.0897 Power Plane
22.1484 Primary Side
22.0915 Printed Contact
22.0916 Printed Edge-Board Contact
22.1216 Quasi-Interfacial Connection
22.1201 Quasi-Interfacial Plated-Through Hole
22.1316 Reduction Marks
22.1232 Reference Edge
22.1233 Reference Hole
22.1236 Regardless of Feature Size
22.1315 Registration Mark
22.1264 Router (CAD)
22.1267 Rubber Banding
22.1517 Secondary Side
22.0934 Signal Conductor
22.0935 Signal Line
22.0936 Signal Plane
22.0977 Solder Resist Aperture
22.0978 Solder Side
22.0990 Spacing
22.0994 Span
22.1211 Supported Hole
22.1042 Tab
22.1052 Terminal Area
22.1053 Terminal Clearance Hole
22.1054 Terminal Hole
22.1055 Terminal Pad
22.1773 Terminations
22.1068 Thermal Relief
22.1086 Through Connections
22.1547 Tooling Feature
22.1094 Tooling Hole
22.1098 Trace
22.1099 Track
22.1106 Trim Lines (Pattern)
22.1550 Trim Lines (Printed Board)
22.1110 True Position
22.1111 True Position Tolerance
22.1129 Unsupported Hole
22.1562 Via
22.1563 Voltage Plane
22.1141 Voltage-Plane Clearance
24 Phototool Generation and Photographic Processes
24.0052 Artwork Master
24.0078 Backlighting
24.0150 Brightness
24.1347 Characteristic Curve
24.1355 Color Temperature
24.0230 Compensated Artwork
24.1792 Composite Test Pattern (CTP)
24.0242 Composite (Phototool)
24.1366 Contact Printing
24.1369 Cosine Law (Illumination)
24.0334 Cut-and-Peel
24.0335 Cut-and-Strip
24.0347 D Curve
24.0350 Definition (Phototool)
24.0356 Densitometer
24.0357 Density (Phototool)
24.0361 Depth of Field (Optical)
24.0368 Developing (Phototool)
24.0371 Diazo Material
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24.0420 Effective Color Temperature
24.0421 Effective Focal Length
24.0633 Illuminance
24.0634 Illumination
24.1791 Individual Test Pattern (IDP)
24.0727 Luminance
24.0728 Luminous Energy
24.0729 Luminous Flux
24.0746 Master Pattern
24.0768 Mirrored Pattern
24.0776 Molecular Dye-Imaging Material
24.1643 Multiple Image Production Master
24.1645 Multiple Pattern
24.0797 Negative (n.)
24.1639 Negative Pattern
24.0811 Opacity
24.1456 Opaquer
24.1195 Optical Image
24.1197 Orthochromatic Emulsion
24.0825 Panchromatic Emulsion
24.1470 Photographic Fog
24.0456 Photographic Image
24.0851 Photographic Operation
24.0852 Photographic Plate
24.0853 Photomaster
24.0854 Photometry
24.0855 Photoplotting
24.0858 Phototool
24.0859 Phototooling
24.0860 Phototooling Aid
24.0864 Pinhole (Phototool)
24.0879 Plotting
24.0888 Positive (n.)
24.0896 Power of Source
24.1642 Production Master
24.1308 Radiometry
24.1234 Reference Master
24.1237 Registered Production Master
24.1243 Render True Color
24.1509 Resolving Power
24.1252 Reversal Development
24.1257 Right Reading
24.1512 Right Reading Down
24.1513 Right Reading Up
24.1270 Runout
24.1205 Scribe Coat
24.1279 Scribing
24.1523 Shadowless Illumination
24.0941 Single-Image Production Master
24.0955 Solarization
24.1004 Spur
24.1537 Step Scale
24.1020 Step Wedge
24.1018 Step-and-Repeat
24.1040 System Effective Color Temperature
24.1104 Transmittance
24.1173 Working Master
25 Electronic Production Data Generation
25.1729 Alphanumerical
25.1329 Automatic Dimensioning
25.0228 Comment Record
25.1358 Composite Record
25.1361 Computer-Aided Manufacturing (CAM)
25.0246 Conditional End-of-Test
25.0254 Conductor Layer No. 1
25.0340 Data Capture
25.0342 Data Layer
25.0337 Data-Entry Device
25.0338 Data-Information Module (DIM)
25.0381 Digitizing (CAD)
25.0398 Distributed Numerical Control (DNC)
25.0490 Feature-Location Record
25.1411 Gerber Data
25.0664 Job Set
25.0716 Local Intelligence
25.0735 Manhattan Distance
25.0736 Manual Data Input
25.0773 Modal Form
25.1176 Nesting
25.1193 Numerical Control (NC)
25.0801 Object Code
25.0829 Parameter Record
25.0867 Pixel
25.0891 Postprocessing
25.1482 Postprocessor
25.1263 Rotational Error
25.1265 Routing Mark
26 Technical Documentation
26.1328 Assembly Drawing
26.0086 Baseline Dimensioning
26.1335 Basic Dimension
26.1778 Basic Specification (BS)
26.1780 Capability Detail Specification (CapDS)
26.0192 Chain Dimensioning
26.1779 Customer Detail Specification (CDS)
26.1740 Detail Specification
26.1781 Detailed Specification (DS)
26.0404 Drafting Image
26.0434 Elementary Diagram
26.0444 Engineering Drawing
26.1782 Generic Specification (GS)
26.1634 Manufacturing Drawing
26.0743 Master Dot Pattern
26.0744 Master Drawing
26.0826 Panel Drawing
26.1486 Printed Board Assembly Drawing
26.1231 Reference Dimension
26.1260 Roadmap
26.1107 Schematic Diagram
26.1783 Sectional Specification (SS)
26.1532 Specification Drawings
26.1091 Tolerance
26.1092 Toleranced Dimension
26.1175 X Axis
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26.1303 Y Axis
26.1809 Z Axis
29 Other (Engineering and Design Issues)
29.0034 Ambient
3 Components for Electronic Packaging
30 General (Component Description Issues)
30.0016 Active Device
30.0019 Add-On Component
30.0236 Component
30.1356 Component Lead
30.0240 Component Pin
30.1735 Component Thermal Masses
30.1737 Cubic Components
30.1738 Cylindrical Components
30.1739 Date Code
30.0369 Device
30.0392 Discrete Component
30.0436 Embedded Component
30.0594 Heatsink
30.1426 Integrated Circuit
30.0681 Large-Scale Integration (LSI)
30.1754 Leadless Component
30.0757 Microcircuit
30.0758 Microcomponents
30.0759 Microelectronics
30.0777 Monolithic Integrated Circuit
30.1460 Package
30.0821 Package Cap
30.0053 Package Cover
30.0822 Package Lid
30.1468 Passive Component (Element)
30.0844 Perimeter Sealing Area
30.0872 Plastic Device
30.1289 Semiconductor
30.1520 Separable Component Part
30.1031 Stud-Mount Termination
30.1772 Surface Mounting Device (SMD)
30.1034 Surface-Mount Component (SMC)
30.1069 Thermal Shunt
30.1559 Very Large-Scale Integration (VLSI)
31 Discrete & IC Through-Hole Component Packages
31.0067 Axial Lead
31.1387 Dual-Inline Package
31.1224 Leaded Chip Carrier
31.1273 Sacrificial-Foil Laminate
31.0942 Single-Inline Package (SIP)
32 Discrete Surface Mount Component Packages
32.0984 Solid-Tantalum Chip Component
33 I/C Package Types for Surface Mounting
33.0100 Beam Lead
33.0098 Beam-Lead Device
33.0182 Castellation
33.0208 Chip Carrier
33.0295 Coplanar Leads
33.0523 Flat Pack
33.1435 Leaded Surface-Mount Component
33.1436 Leadless Chip Carrier
33.0694 Leadless Device
33.1437 Leadless Inverted Device
33.1438 Leadless Surface-Mount Component
33.0869 Planar-Mount Device
35 Bare Die
35.0151 Broken Pick
35.0205 Chip
35.0373 Dice
35.0375 Die
35.0400 Doping
35.0666 Junction Temperature
35.0949 Slice
35.1122 Uncased Device
35.1145 Wafer
36 Component and Lead/Termination Properties
36.0006 Accordion Contact
36.0017 Active Metal
36.0075 Backfill
36.1337 Bellows Contact
36.1810 Bifurcated Contact
36.1732 Butt Leads
36.1345 Carrier Tape
36.0243 Compression Seal
36.1741 Dissolution of Metalization
36.0424 Elastomeric Connector
36.1747 Gull Wing Leads
36.0590 Header (Module)
36.1752 J-Leads
36.0688 Lead
36.0696 Lead Pin
36.0698 Lead Wire
36.0785 Multilayer Carrier Tape
36.0807 Omnibus Ring
36.1764 Rectangular Leads
36.1528 Single-Layer Carrier Tape
36.1025 Stress Relief
36.1033 Support Ring
36.1546 Three-Layer Carrier Tape
36.1554 Two-Layer Carrier Tape
36.1164 Window (Carrier Tape)
37 Components for Wiring and Cabling
37.0106 Bifurcated Solder Terminal
37.1338 Birdcage
37.0145 Boss (Connector)
37.0169 Bus Bar
37.0203 Chemical Wire Stripping
37.0218 Closed-Entry Contact
37.0220 Coaxial Cable
37.0265 Connector
37.0271 Connector Housing
37.0272 Connector Tang
37.0268 Connector, Two-Part, Printed Board
37.0282 Contact Spring
37.0318 Crimp Contact
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