MV-9_Chapter 5. Teaching.pdf
MV -9 User Manual Chapter 5. T eaching In this chapter , creation m ethod of PCB m odel , teaching types and teach i ng m ethod s, type of each windo w fr ame and popu p menu and how to use will be described .
MV-9
User Manual
Chapter 5. Teaching
In this chapter, creation method of PCB model, teaching types and teaching
methods, type of each window frame and popup menu and how to use will be
described.
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于要在此处显示的文字。 .
5-3
5.1.Mounting PCB ................. 5-6
5.1.1.Executing program .......................................................................................... 5-6
5.1.2.Mounting PCB ................................................................................................. 5-6
5.2.Creating and opening PCB model ............... 5-10
5.2.1.Creating new model ....................................................................................... 5-10
5.2.2.Opening the existing model ........................................................................... 5-19
5.2.3.Modifying model ............................................................................................ 5-20
5.3.Component teaching ............... 5-21
5.3.1.Basic color concept ....................................................................................... 5-22
5.3.2.Mounting inspection window ................................ ................................ .......... 5-26
5.3.3.Solder inspection window .............................................................................. 5-35
5.3.4 Optical character inspection window ............................................................. 5-64
5.3.5.Binary inspection window............................................................................... 5-68
5.3.6.IC/Bridge inspection window ........................................................................ 5-106
5.3.7.Color inspection window ................................ ................................ .............. 5-141
5.3.8.Chip component inspection window ............................................................ 5-151
5.3.9.Height inspection window ............................................................................ 5-156
5.3.10.Lifted inspection window ............................................................................ 5-159
5.3.11.Resistance color band inspection window .................................................. 5-161
5.3.12.IC offset inspection window ....................................................................... 5-167
5.3.13.Chip color inspection ................................................................................. 5-176
5.3.14.Teaching by using side viewer ................................................................... 5-191
5.3.15.Teaching by using divided light .................................................................. 5-192
5.4.LED BLU inspection ............. 5-193
5.4.1.Teaching of LED package with reference point ............................................ 5-196
5.4.2.Teaching of LED package with no reference point ....................................... 5-205
5.4.3.Finding center position of LED package ...................................................... 5-214
5.5.Additional teaching function ............. 5-220
5.5.1.Functions in whole PCB image screen ........................................................ 5-220
5.5.2.Functions in frame image screen ................................................................. 5-237
5.5.3.Additional functions during inspection window selection .............................. 5-242
5.5.4.Additional functions during multiple inspection window selection ................ 5-245
5.6.3D Teaching ............. 5-249
5.6.1.Selection of Window for Mounting Inspection .............................................. 5-249
5.6.2.Selection of “Use 3D Inspect “Option ........................................................... 5-249
5.6.3.Projector Selection ................................................................ ....................... 5-249
5.6.4.Selection of Mounting Type .......................................................................... 5-250
5.6.5.Position Setting ............................................................................................ 5-250
5.6.6.Part Information Measurement .................................................................... 5-251