MV-9_Chapter 5. Teaching.pdf - 第112页
MV -9 Use r Manual 5-1 1 2 ④ Check at „ IC color ‟ in I C Br i dge inspect i on , and check at IC color in color inspection. ⑤ Check at pixel rat i o in color inspection. For inspection of comp ar ison w i th average val…
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② Select „manual‟ on lead tap, and set lead tip offset to be same with solder amount inspection
(general inspection).
③ Select „auto‟ on lead tap, and set solder inspection area setting, search start position, search
range, min fillet size and lead tip range.
④ Check at „Use manual lead tip‟ if auto lead tip search fails
⑤ Select lead tap, and check at „Use lead inspection‟ and set inspection criteria.
⑥ Select fillet tap, and set binarization and normal criteria.
⑦ Select pad tap, and set binarization and normal criteria. Not to use pad inspection, check at
„Ignore pad area inspection‟.
[Figure 5-120 IC Bridge – solder amount inspection (advanced inspection) teaching (lead tip auto
setting)]
6) IC color teaching method
- In case of occurrence of lifted lead, IC color inspection detects lifted lead defect using the
characteristic of which color of lead shoulder or lead tip is different from normal. This
method detects defect through color inspection for intersection area between lead
separation area and color inspection window area in IC Bridge inspection window.
① Draw inspection window in IC Bridge inspection teaching method.
② Draw color inspection window in area for color inspection.
③ Select both of IC Bridge inspection window and color inspection window, and select „Group
component‟ in popup menu (click the right button of a mouse).
MV-9 User Manual
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④ Check at „IC color‟ in IC Bridge inspection, and check at IC color in color inspection.
⑤ Check at pixel ratio in color inspection. For inspection of comparison with average value,
check at IC average ratio inspection+ (%).
[Figure 5-121 IC color inspection teaching]
7) Example of representative component teaching
Drawing IC Bridge window
Draw window to include all areas in which Bridge can occur.
If the end of window includes package, bridge defect can occur by package area. Hence,
draw from position a little away from package to lead end.
Compensation using compensation window
Inspection position can be out of actual inspection position a little bit due to robot error or
others if real robot is moved during. Hence, add compensation window and group them
into a component for bridge inspection. compensation window finds actual position of
Bridge for compensation of bridge window to increase inspection reliability.
In general, set bridge compensation window at which lead starts at package and use
search range at lead direction for search range in compensation window and use small
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于要在此处显示的文字。 .
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search range for others. For example, set X-side search range to be large search range
of Y-side search range to be small
For compensation window, use general mounting window. Like bridge, group them into a
component to make compensation window.
Draw small IC component
In case of IC component of which all components get into one frame, draw bridge for
each lead, and set compensation window and group into a component at one edge.
For search range of compensation window, set about 20 of value for both of width and
height.
Draw large IC component
Conduct individual teaching for large IC component by moving frame.
2 4 3 5 A B C
2 4 3 5 A B C
[Figure 5-122 IC component teaching example]
Lead tip display
If lead tip auto search option is set for initial teaching, position of solder inspection width
will be drawn based on lead tip search start position. However, position of solder
inspection width will be displayed based on lead tip position found from manual inspection
more than 1 time.
[Figure 5-123 lead tip auto search]