MV-9_Chapter 5. Teaching.pdf - 第126页
MV -9 Use r Manual 5- 126 - Solder amount inspection ( gener al inspe ct i on ) is to inspect insufficient solder/no solder and li f ted using lead amount (white pixel ratio) i n fil l et area. - Solder amount inspection…
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-125
lead tip range
No use of color inspection –
manual
No use of color inspection – auto
Use of color inspection – manual
Use of color inspection – auto
[Figure 5-139 lead tip search setting example]
13) Parameter of solder amount inspection (general inspection)
- Solder area found in the previous solder amount inspection conducted.
MV-9 User Manual
5-126
- Solder amount inspection (general inspection) is to inspect insufficient solder/no solder
and lifted using lead amount (white pixel ratio) in fillet area.
- Solder amount inspection (general inspection) uses white tap and color tap, and use
horizontal + vertical light image or horizontal - vertical image.
Horizontal + vertical light image horizontal - vertical image
[Figure 5-140 solder amount inspection image]
Common parameter
- Solder inspection area setting: effective solder inspection width ratio
100% of width (width of lead calculated in lead separation stage) can be inspected
by setting effective solder inspection width ratio (%)and 50% or inspection area of
width can be set according to setting value.
[Figure 5-141 solder inspection area setting]
- Use color inspection
Set this function to use color algorithm for solder inspection. This will be activated by
checking at „Use color inspection‟ on lead tip tap. Check at this item to use advanced
inspection.
- Number of min solder defect
Even if there is lead judged as defect, if the number is lower than min solder defect after
inspection, final inspection result will be normal.
- Color binarization
Check at this option to conduct binarization used color map in general inspection.
Inspection area
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-127
[Figure 5-142 common parameter for solder amount inspection]
White parameter
When comparison inspection is not
selected
When comparison inspection is
selected
[Figure 5-143 solder amount inspection setting_white]
[Table 5-13 Solder inspection area setting value]
Item
Recommended setting value
light
horizontal + vertical light (Sometimes horizontal - vertical)
image type
B (L for horizontal - vertical)
binarization type
manual
binarization level
90 ~ 170 (Differ from samples)
binarization condition
High – Low ( )