MV-9_Chapter 5. Teaching.pdf - 第133页
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MV-9 User Manual
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Fillet parameter
[Figure 5-149 solder amount inspection setting_fillet and preview image]
- Binarization
Use color ratio and binarization boundary value for binarization.
Color ratio: set ratio of blue to red of fillet area. Pixel of which color ratio is above
reference value will be displayed in blue, and pixel of which color ratio is below
reference value will be displayed in green.
Binarization boundary value: pixel of which red and blue value is below binarization
value will be all „0‟ (black).
- Normal criteria
Effective fillet area (%): set ratio of pixel that is above binarization boundary value for
total fillet area (black is excluded). detect some of insufficient solder/no solder and lifted.
If it is below reference value, judge as defect.
Blue pixel ratio (%): set ratio of blue pixel to fillet area. If it is above min value (Ex: 20%),
it is defect. If it is above max value (Ex: 60%), it is normal. If it is between min value and
max value, the 2
nd
judgment will be made by using other setting values.
Min color ratio: set color ratio of blue in fillet area. Detect some of insufficient solder/no
solder and lifted. If it is below reference value, judge as defect.
Red pixel thickness (%): thickness of red pixel (green in preview image) of pad. If lifted
lead occurs, detect defect using the characteristic of which red area of pad area
narrows.
Lead tip distance: distance between position of each lead tip and average lead tip
position of total lead. If it is above reference value, judge as defect. In case lifted lead
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-133
occurs, detect defect using the characteristic of which position of lead tip different from
normal position.
Shoulder ratio (%): If it is within ± setting criteria based on average color of total
shoulder, judge as good. If lifted lead occurs, detect defect using the characteristic of
which color of lead shoulder part changes.
[Figure 5-150 solder amount inspection setting_fillet: lifted lead defect example]
Pad parameter
[Figure 5-151 solder amount inspection setting_pad and preview image]
- Binarization
Use color ratio and binarization boundary value for binarization.
Color ratio: set ratio of red to blue in fillet area. Pixel of which color ratio is above
reference value will be displayed in red, and pixel of which color ratio is below reference
value will be displayed in green.
MV-9 User Manual
5-134
Binarization boundary value: pixel of which red and blue value is below binarization
value will be all „0‟ (black).
- Ignore pad area inspection
Set whether to inspection for pad area or not
- Normal criteria
Effective pad area (%): define ratio of pad area for all of fillet area and pad area and
detect insufficient solder/no solder. Conduct the 2
nd
inspection only when pad area is
between min value and max value. If it is below min value, judge as good. If it is above
max value, judge as insufficient solder/no solder.
Red pixel ratio (%): the 2
nd
inspection for pad area. set ratio of red pixel to total pad area.
If lifted occurs, detect lifted defect using the characteristic of which red area of pad area
narrows. If it is below reference value, judge as defect.
15) Parameter of IC color inspection
- If lifted lead occurs, IC color inspection detects defect using the characteristic of which
lead color is different.
Inspection area is intersection area of lead separation area and color inspection area.
[Figure 5-152 IC color inspection area]
IC Bridge inspection window
- IC color: Select function to inspect lead color by interlocking with color inspection window.
Color inspection window
- IC color: select function for lead color by interlocking with IC Bridge inspection window.
- Pixel ratio: set normal min ratio value to judge good/defect.
- IC average ratio inspection+ (%)
Select for comparison inspection with average value of pixel ratio of all inspection
area