MV-9_Chapter 5. Teaching.pdf - 第174页
MV -9 Use r Manual 5- 174 [Figure 5- 210 inspection option and normal criteria] Normal criteria - L ead offset This item is to inspect Sh i f t of IC package. L ead offset (X): set good/defect judgm ent cr iteria f…
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Generally, set B (Blue) for inspection type, and L (Luminance) can be selected.
select color that is different from PCB for pad inspection image. In other words, blue
(B) is selected when PCB is green, and green (G) is selected when PCB is blue.
- Binarization boundary value
Select auto or manual for binarization method. If „manual‟ is selected, adjust
binarization value for good separation of lead.
- Noise removal
Set stripe width and area value to remove noise between lead and lead.
If stripe width value is set high, lead area will narrow. Hence, set it below 2.
Area is to remove white area that exists between lead and lead. adjust the value
checking preview image.
- Search start position and search range
Set this in area in which pad inspection is desired to be conducted, and set range in
which pad width clearly appears.
- Contrast level
Set contrast level to detect change of edge. In general, set it below 20.
- Use sub light
Check this option to conduct additional inspection using sub light.
In case of defect at default light, conduct inspection using sub light.
Set same parameter excluding light type and inspection type (image type) with that
of default light.
Use light type and inspection type different from light type that is use in default light.
In general, horizontal + vertical light is selected when default light is used, and
horizontal light or user light is selected when sub light is used.
Inspection option
- Calculate only end of side lead (lead shift)
This will be activated if lead shift ratio inspection is checked in normal criteria.
For lead shift ratio inspection, conduct inspection only for the first lead and the last
lead.
- Side lead comparison (lead tip)
This will be activated if lead tip offset inspection is checked in normal criteria.
Re-calculate lead tip position of each lead considering angle. make good/defect
judgment based on lead tip offset setting value by comparing with lead tip position
of side lead.
MV-9 User Manual
5-174
[Figure 5-210 inspection option and normal criteria]
Normal criteria
- Lead offset
This item is to inspect Shift of IC package.
Lead offset (X): set good/defect judgment criteria for distance between lead center
and pad center.
Lead offset (Y): set good/defect judgment criteria for degree of lead shift.
- Lead shift ratio
This item is for inspection for shift or lead bending of IC package. set lead shift
criteria. Lead shift ratio is defined by the ratio of overlapped area of lead and pad,
and calculate to (b / a) x100.
[Figure 5-211 pad inspection parameter screen]
- Bridge offset (angle)
This option will be activated if lead offset of normal criteria is checked.
Set angle offset criteria of Bridge.
- Lead tip offset
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Set good/defect judgment criteria for difference with average value of all lead tip
position or difference with lead tip of adjacent lead (for side lead comparison
setting).
4) Inspection result in status screen
- Number of Lead: display number of lead.
- Bridge Offset Angle: angle of IC package calculated by using position of lead tip.
- Lead Count Direction [unit]: increase direction of lead No. Unit is the unit of displayed data.
- Lead Offset: difference between distance from pad end to lead tip and pad length (value
set on teaching tap).
- Lead Width: lead width detected in lead search range.
- Pad Width: pad width detected in pad search range.
- Bias Ratio: overlap ratio of pad and lead
- Lead Tip: lead tip difference (difference between average value and adjacent lead).
[Figure 5-212 IC offset inspection result image]
[Figure 5-213 IC offset inspection result screen]