MV-9_Chapter 5. Teaching.pdf - 第35页

错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。错误 ! 使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。 . 5- 35 5.3.3. Solder inspection window - Solder inspection i s divided into g enera l i nspection , color inspection , and wave so l der inspe c t…

MV-9 User Manual

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[Figure 5-36 mounting inspection window inspection result screen]

 Shape

- This is to display inspection type (inspection algorithm).

 Defect name

- This is to display inspection result and item selected at good/defect type.

 No

- Number in square bracket means the order of registered pattern image for the relevant

component. If polarity is not set among inspection options, images rotated for one sub

image will be inspected at the same time. Hence, there will be 2 models.

 Matching ratio

- The value displayed in percent is matching ratio between image registered in pattern

image screen and imaged image.

 Chip re-inspection

- Chip re-inspection result will be judged and displayed by „O/X‟.

 Success

- This will be displayed for a model that successfully completed matching among registered

many models.

 Max matching ratio

- This is to display max matching ratio among the registered models. Percent in brace

means normal judgment matching score.

 Offset (x, y)

- This is to display offset value from the center of inspection window to the center of

component found in search area in pixel unit.

错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用

于要在此处显示的文字。 .

5-35

5.3.3. Solder inspection window

- Solder inspection is divided into general inspection, color inspection, and wave solder

inspection, and inspection for solder part of mounted component will be conducted.

 General inspection: This is used to inspect no solder, insufficient solder and excessive solder

and defects of solder part of component. Besides basic soldering inspection, general

inspection can selectively conduct non-mounting inspection (soldering) and non-mounting

inspection (mounting).

 Color inspection: surface crack defect inspection of BGA or CSP (chip scale package) or

soldering status inspection of array component can be selectively conducted.

 Wave solder inspection: This is to inspect soldering status of manual mounting component by

flow or wave soldering process.

 5.3.3.1. General inspection

1) Soldering inspection (basic)

① Teaching method

- Click <soldering inspection window> button among operating buttons.

- Draw inspection window in soldering area desired to be inspected.

- Select light type of horizontal + vertical light ( ) in which soldering area of component is

clear and select B (blue) for image type.

- Select preview, and adjust binarization method and binarization value for good separation

of soldering area. If soldering area does not separated well, check color map and select

setting to set color and saturation range.

- Enter normal criteria.

MV-9 User Manual

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[Figure 5-37 Screen to create soldering inspection (basic) window]

② Parameter of soldering inspection (basic) window

 Reference name

- Refer to „reference name (page5-21) ' in „5.3.1 mounting inspection window‟‟ excepting

shape.

- Created in „_SLD_1_‟ format. „SLD‟ means Solder and number means creation order of

solder amount inspection window.

 Component name

- Refer to „component name‟ in '5.3.1 mounting inspection window‟‟.

 Rotation angle

- Refer to „rotation angle‟ in '5.3.1 mounting inspection window‟‟.

 Defect type

- Refer to „defect type‟ in '5.3.1 mounting inspection window‟.

 Light type

- Select light type and image type in which soldering area of component is clear.