MV-9_Chapter 5. Teaching.pdf - 第49页
错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。 错误 ! 使用“开始”选项卡将 제목 2 应用 于要在此处显示的 文字。 . 5- 49 (e) Select inside or outside as norm al range. (f) Set crack inspection criteria. CSP crack d efect CSP nor m al [Figure 5- 53 Screen to cr…
MV-9 User Manual
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5.3.3.2. Color inspection
1) Crack inspection
- Crack inspection algorithm is to detect crack defect of BGA surface or other components.
- Crack characteristic
Chipping or Crack part appears relatively lighter Red or lighter Blue than normal
surface in color light and appears relatively brighter or darker than normal surface
in white light.
The figure below shows normal image and Chipping or Crack defect image.
BGA
CSP
normal
normal
normal
normal
defect – vertical light
defect - horizontal
light
defect - color light
defect - color light
[Figure 5-52 Normal image and crack defect image]
① Teaching method
(a) Draw on solder window on inspection target area of a component. In general, set whole
chip package as an inspection area.
(b) Select color inspection and select crack in component type.
(c) Select horizontal + vertical light for light type, and select A (all band = R+G+B) or L for
image type. In case of white light, use horizontal or vertical light that shows well and
select L for image type.
(d) Use color map and binarization to separate crack defect of BGA or CSP.
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-49
(e) Select inside or outside as normal range.
(f) Set crack inspection criteria.
CSP crack defect
CSP normal
[Figure 5-53 Screen to create color inspection – crack inspection window]
② Parameter of color inspection – crack inspection window
- Inspection type
Select color inspection to inspect crack defect of BGA or CSP.
- Light type and image type
In general, select horizontal + vertical light, and select A or L for image type.
However, since there are various shapes of defect, other lights (vertical or
horizontal) and select light and image type in which defect can be separated will by
changing image type.
If defect is not separated well in default light, use user light.
MV-9 User Manual
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Horizontal light
Vertical light
Horizontal +
vertical light
User light
[Figure 5-54 Images according to light types]
- Component type
Crack: detect BGA package damage or crack defect of CSP.
- Color map and binarization
If horizontal + vertical light and image type A is selected, adjust color and luminance
(binarization) in color map to separate defect.
If horizontal + vertical light and image type L are selected, select red for color map
type, and adjust luminance (binarization).
If vertical or horizontal light is selected, select L for image type, and adjust
luminance (binarization) to separate defect.
BGA package damage and CSP crack defect variously differ from the status.
- Normal range
Inside and outside can be selected for normal range. Pixel included in the selected
area will be displayed in RGB or white.
Inside means lower area than area (dotted line display area) and binarization
setting value set in color map.
Outside means range excluding inside area.
- Crack inspection criteria
„Exclude other inspection area‟: In case inspection area that completed teaching is
overlapped with other inspection window, check at this option. other inspection
windows will be treated as „Don‟t care region‟.
Min area: min area to judge area separated in color map and through binarization
as defect. Area smaller than setting value will be judged as normal regardless of
the result of other inspection items.
Min width: This is to detect crack larger than specific width. In case area is smaller
than min area, conduct width inspection. If it is smaller than setting value, judge as
good.