MV-9_Chapter 5. Teaching.pdf - 第50页
MV -9 Use r Manual 5- 50 Horizontal li ght V erti cal light Horizontal + vertical light User light [Figure 5- 54 Images according to light types] - Component type Crack : dete ct BGA package dam age or cr ack defect of…
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(e) Select inside or outside as normal range.
(f) Set crack inspection criteria.
CSP crack defect
CSP normal
[Figure 5-53 Screen to create color inspection – crack inspection window]
② Parameter of color inspection – crack inspection window
- Inspection type
Select color inspection to inspect crack defect of BGA or CSP.
- Light type and image type
In general, select horizontal + vertical light, and select A or L for image type.
However, since there are various shapes of defect, other lights (vertical or
horizontal) and select light and image type in which defect can be separated will by
changing image type.
If defect is not separated well in default light, use user light.
MV-9 User Manual
5-50
Horizontal light
Vertical light
Horizontal +
vertical light
User light
[Figure 5-54 Images according to light types]
- Component type
Crack: detect BGA package damage or crack defect of CSP.
- Color map and binarization
If horizontal + vertical light and image type A is selected, adjust color and luminance
(binarization) in color map to separate defect.
If horizontal + vertical light and image type L are selected, select red for color map
type, and adjust luminance (binarization).
If vertical or horizontal light is selected, select L for image type, and adjust
luminance (binarization) to separate defect.
BGA package damage and CSP crack defect variously differ from the status.
- Normal range
Inside and outside can be selected for normal range. Pixel included in the selected
area will be displayed in RGB or white.
Inside means lower area than area (dotted line display area) and binarization
setting value set in color map.
Outside means range excluding inside area.
- Crack inspection criteria
„Exclude other inspection area‟: In case inspection area that completed teaching is
overlapped with other inspection window, check at this option. other inspection
windows will be treated as „Don‟t care region‟.
Min area: min area to judge area separated in color map and through binarization
as defect. Area smaller than setting value will be judged as normal regardless of
the result of other inspection items.
Min width: This is to detect crack larger than specific width. In case area is smaller
than min area, conduct width inspection. If it is smaller than setting value, judge as
good.
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Min length: set min length to judge as defect. Crack of length below setting value
will be judged as normal. In case area is smaller than min area, conduct width
inspection. If it is smaller than setting value, judge as good.
③ Color inspection – crack inspection result in status screen
- Area: area detected as defect (number of pixel).
- Width of Crack: width of area detected as crack defect.
- Length of Crack: length of area detected as crack defect.
[Figure 5-55 Crack inspection result in status screen]
2) Array inspection
① Teaching method
(a) Draw solder window in solder area in a component.
(b) Select color inspection and select „array‟ for component type.
(c) Select horizontal + vertical light for light type, and select A (all band = R+G+B) for image
type.
(d) Divide well red, green and blue area using color map and binarization.
(e) Set inspection criteria.