MV-9_Chapter 5. Teaching.pdf - 第77页
错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。 错误 ! 使用“开始”选项卡将 제목 2 应用 于要在此处显示的 文字。 . 5- 77 Angle inspection using SubPixel - If SubPixel is used , it segment inspection area . Position of bo u ndar y li ne detected in segm ente …
MV-9 User Manual
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Left to Right: search boundary line from left to right.
Black to White: detect positive boundary line.
- Pixel:
Pixel express position of boundary line and normal range by the number of pixel in
the inspection window. There is min, current and max. Value in brackets next to
max value means max allowable value.
Position detected by search type will be displayed for current value.
- Micro Unit: this information is displayed when real unit information view is selected in
[Config. - Default setting - view]. Real length relevant to pixel.
[Figure 5-81 position move inspection result]
Line inspection
- Pixel: current value (11.6, 28.1) is the position of intersection point of left and right ends of
boundary line and inspection window in inspection window.
[Figure 5-82 line inspection result]
Angle inspection
- Fit Angle: angle of detected boundary line.
- Angle Offset [Ref Offset]: angle of detected boundary line, and Ref Offset means reference
Angle Offset for good/defect judgment.
[Figure 5-83 angle inspection result]
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-77
Angle inspection using SubPixel
- If SubPixel is used, it segment inspection area. Position of boundary line detected in
segmented area will be displayed in the screen.
[Figure 5-84 Angle inspection result using SubPixel]
MV-9 User Manual
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5) Solder ball inspection
- This inspection method is to detect solder ball on pad or substrate. Basic principle is to
separate solder ball inspection target area and to detect solder ball on the area. In other
words, if white area exists in both of 2 areas, judge as solder ball.
- For pad and bridge binarization, we separate solder ball inspection target area and
separate solder ball area for solder binarization.
- The followings are general characteristics of image of solder ball according to light.
Margin of solder ball appears in blue in horizontal + vertical light image and central
part of solder ball appears in red.
If white light is used, margin of solder ball appears in horizontal light, and central
part of solder ball appears in vertical light.
① Teaching method
(a) Draw binary inspection window in inspection area and select solder ball inspection for
inspection type.
(b) Select preview in operation window and select preview – pad for parameter.
(c) Select light type and image type for pad/Bridge binarization.
(d) If there is other inspection window in inspection area, check at „exclude other inspection
area‟.
(e) Set binarization method and binarization value checking image.
(f) To remove noise, adjust size filtering and space filling value.
(g) Select preview – solder for parameter.
(h) Select light type and image type for Solder binarization.
(i) Set binarization method and binarization value checking image.
(j) To reverse an image, check image reverse.
(k) Set „Don‟t care region‟.
(l) Enter normal criteria. Basically, we conduct ratio inspection. In case of inspection using
number of white pixel, check white pixel inspection.