MV-9_Chapter 5. Teaching.pdf - 第79页
错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。 错误 ! 使用“开始”选项卡将 제목 2 应用 于要在此处显示的 文字。 . 5- 79 solder ball on pad solder ball on substrate solder ball on LED substrate [Figure 5- 85 T eachin g example of solder ball inspection window]…
MV-9 User Manual
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5) Solder ball inspection
- This inspection method is to detect solder ball on pad or substrate. Basic principle is to
separate solder ball inspection target area and to detect solder ball on the area. In other
words, if white area exists in both of 2 areas, judge as solder ball.
- For pad and bridge binarization, we separate solder ball inspection target area and
separate solder ball area for solder binarization.
- The followings are general characteristics of image of solder ball according to light.
Margin of solder ball appears in blue in horizontal + vertical light image and central
part of solder ball appears in red.
If white light is used, margin of solder ball appears in horizontal light, and central
part of solder ball appears in vertical light.
① Teaching method
(a) Draw binary inspection window in inspection area and select solder ball inspection for
inspection type.
(b) Select preview in operation window and select preview – pad for parameter.
(c) Select light type and image type for pad/Bridge binarization.
(d) If there is other inspection window in inspection area, check at „exclude other inspection
area‟.
(e) Set binarization method and binarization value checking image.
(f) To remove noise, adjust size filtering and space filling value.
(g) Select preview – solder for parameter.
(h) Select light type and image type for Solder binarization.
(i) Set binarization method and binarization value checking image.
(j) To reverse an image, check image reverse.
(k) Set „Don‟t care region‟.
(l) Enter normal criteria. Basically, we conduct ratio inspection. In case of inspection using
number of white pixel, check white pixel inspection.
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-79
solder ball on pad
solder ball on substrate
solder ball on LED
substrate
[Figure 5-85 Teaching example of solder ball inspection window]
① Parameter description
Pad/Bridge binarization
- Light type and image type
Use parameter in common parameter window for light type and image type for pad
binarization. In general, select B type or L of horizontal + vertical light. Sometimes,
select L type of vertical light.
- Exclude other inspection area
Check at this option if inspection area that completed teaching and other inspection
window is overlapped. other inspection window will be regarded as „Don‟t care
region‟.
- Binarization
Set auto or manual for binarization. Set binarization value checking preview-pad
during manual setting.
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To detect Solder ball on LED substrate, set binarization value to „0‟ to make total
inspection window in white in preview.
- Size filtering, space filling
For detection of solder ball on pad, set binarization to low value. Set size filtering to
low value, and increase space filling to clearly display whole pad area.
To detect Solder ball on LED substrate, it‟s fine not to set it.
solder ball on pad
solder ball on substrate
[Figure 5-86 pad/Bridge binarization preview image]
Solder binarization
- Light type and image type
Select light type and image type to separate solder ball
In general, select horizontal + vertical light-B type or select horizontal light-L type.
- Binarization and color allowable value
Set binarization value and color allowable value for good separation of solder ball
checking preview-solder.
Color allowable value: setting to tell chromatic color from achromatic color. Inspect
RGB color in white area in solder binarization image to recognize difference of max
value and min value of RGB value. If the difference is above color allowable value,
in other words, in case of achromatic color, recognized as hole or scratch not solder
and excluded. The lower setting is, the most area is excluded. The higher setting is,
the smaller excluded area.
- Image reverse
This function is to reverse binarization image. set this function to detect Solder ball
on LED substrate