Vision_Serie_EN_2023 - 第11页
11 lter cooler drop formation pyrolysis closed loop process atmosphere closed loop cooling Residues are separated with the help of a special gr anulate during pyrolysis. Long molecular chains are broken down (cr acked) …
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A clean machine:
effective Residue Management
As is the case with all industrial processes,
substances are generated during SMT produc-
tion which have to be removed from the process
cycle because they contaminate the system. Our
highly effective residue management function
puries the process gas safely and reliably, and
keeps your system clean and dry.
The residue management function included in
the Vision-Series combines depending on the
system type two different modes of action: py-
rolysis in the heat zone and cold condensation in
the cooling tract’s lter units. Liquid and crystal-
line residues are effectively removed by means of
this combination.
VisonXP+, Vision XP+ Vac and Vision TripleX
are equipped with with pyrolysis in the heating
zone and and lter units in the cooling zone as
standard. Pyrolysis can optionally be added to Vi-
sionXS models for the purposes of cold trapping.
VisionXC systems are tted with cooler lter
units in their cooling zone.
In order to make your manufacturing system
even more efcient, the VisionXP+ is optionally
available with double pyrolysis. Your system’s
cleaning efciency is signicantly increased.
The rst pyrolysis unit is located underneath the
inlet area and puries the process gas from the
lower heating zones. The second pyrolysis unit
is installed on top of the inlet area and lters the
process gas from the heating zones. Cleaning
efciency is signicantly increased for the pro-
cess gas and the soldering system’s chambers
are kept clean and dry with very little maintenance
and minimal downtime.
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lter
cooler
drop formation
pyrolysis
closed loop process atmosphere closed loop cooling
Residues are separated with the help of a special granulate during
pyrolysis. Long molecular chains are broken down (cracked) into smaller
elements by means of thermal ssion. Temperatures from about 500 °C
are required to this end. Afterwards, the molecular chains are small
enough to be taken up by the granulate and removed from the pro-
duction process. The granulate only needs to be changed once a year,
making the pyrolysis unit easy to maintain – and you prot from minimal
downtime. Your manufacturing processes continue to run smoothly.
Pyrolysis at 500 °C
Liquid residues condense above all on the cooling
tract’s lter units, by which they are then removed.
The system is easy to clean. The lters are ex-
changed in sets at the back of the system. The
process chamber doesn’t even have to be opened.
Depending on system type, the oven is equipped
with a 2, 3 or 4-stage condensation trap.
Cold condensation
Efcient cleaning for a clean and dry process chamber
System integrated solution
Reliable, stable process
Easy accessibility
Low maintenance effort
low
maintenance
expenses
not available for VisionXC
Vision-Series | Residue Management
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It is important to have a high-performance cooling tract in order to guarantee optimum
soldering results and ensure that modules are cooled gently.
Rehm Thermal Systems offers a wide range of cooling tract variants for reow convection
soldering with its VisionX-Series, which can be precisely ne-tuned to suit any production
process. The water-cooled standard solution with heat exchanger and adjustable ventilation
system works as an effective "Closed Loop" system. There are several efcient, additional
options for large and high-mass boards, primarily a power cooling unit as an extended
cooling tract or a bottom cooling system.
Stress-free to below 50 °C
with powerful cooling systems
Stress-free cooling using individually adjustable ventilators in the classic cooling zones
Gentle cooling through the use of the power cooling unit as an extended cooling tract
Optimum cooling of large, high-mass boards thanks to additional bottom cooling
Flexible combination possibilities through a range of different options
New, sustainable cooling principle as a result of liquid nitrogen cooling