Vision_Serie_EN_2023 - 第14页
14 2-in-1solution for reow soldering VisionXP+ with or without vacuum Energy-efcient, low-maintenance and void-free - with the Vision T ripleX, we offer an innovative solution for reow sol - dering. The combination of…
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Power Cooling Unit
Rehm CoolFlow
In order to cool complex modules it is possible to extend
the cooling zones using a power cooling unit. As part of this
process, cold air is fed onto the board from above and below,
where it can be cooled in a more intensive, gentle manner as
a result of the process being extended. The power cooling
unit can be implemented in the form of an extension to the
standard cooling zones under nitrogen atmosphere and
is also available as a separate, downstream module for
increased cooling capacity for insensitive materials under
normal atmospheric conditions.
Rehm Thermal Systems has been working with its partner
Air Liquide to develop an innovative cooling principle for the
effective use of the nitrogen required for inertisation and
designed the rst coolant-water-free reow soldering system
with liquid nitrogen cooling. The liquid nitrogen, which reaches
temperatures as low as -196 °C, cools the inside of the cooling
tract, evaporates and is then used for inertisation whilst in a
gaseous state. This not only provides the system with the nec-
essary coldness, but also the inert environment. As a result,
the coolant water that is re-cooled using a high amount of
energy, as well as the cooling unit and refrigerant are no longer
required at all. This method could save around 17 tonnes of
CO
2
and 30,000 kWh per system, per year.
The Vision-Series transforms the classic cooling tract into a two or four-layer system, depending on the
facility. This design incorporates an active cooling process, water-cooled using heat exchangers following
an efcient "Closed Loop" system. The process air is cooled in the heat exchangers and then ows onto
the module from above. The air is subsequently sucked underneath, cleaned using a lter system and
is then ready for the next cooling process. Individually adjustable ventilators in each of the zones make
it possible to precisely control the cooling process and inuence the cooling gradient by adjusting the
speeds.
Bottom cooling makes it possible to cool high-mass boards
easily and effectively. The cold process air is blown onto the
board in equal measures from above and below in order to
facilitate a particularly homogeneous cooling process and
to reduce tension in the material. It is possible to adjust the
ventilator speeds for each module. This means additional
cooling measures, such as an outfeed belt with ventilators,
are unnecessary thanks to the low outlet temperatures. It is
predominantly modules with inhomogeneous distribution of
the copper positions that will be protected against twisting
and warping as a result of bottom cooling.
Closed Loop System
Bottom Cooling
Cooling zone with bottom cooling
Power Cooling Unit PCU
only VisionXP+
Vision-Series | Cooling
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2-in-1solution for reow soldering
VisionXP+ with or without vacuum
Energy-efcient, low-maintenance and void-free - with the Vision TripleX, we offer an innovative solution for reow sol-
dering. The combination of vacuum unit and condensation soldering process in only one system provides undreamt-of
possibilities!
Vision TripleX is a patented new development in the eld of convection and vapour phase soldering. The system is based
on the reow convection soldering systems of the Vision series and combines the convection soldering process with the
proven vapour phase soldering process of the Condenso series. Thus, three processes can be run in the Vision TripleX:
Reow convection soldering with and without vacuum as well as vapour phase soldering using Galden
®
. This offers
uniquely exible manufacturing options.
3-in-1: The combination of classical convection soldering, convection soldering
under vacuum and condensation soldering in only one system
Flexible temperature proling due to the combination of convection and condensation,
in combination with the applicable atmosphere (air, N2 and/or Galden
®
)
High quality solder joints on assemblies with large differences in
thermal mass
Compared to existing Condenso systems, the Vision TripleX requires no additional
carrier is necessary
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Opened vacuum chamber of the VisionXP+ Vac
Divided, separately regulated transport system
The systems with vacuum chamber are equiped with atripar-
tite transport system: pre-heating/peak area, vacuum unit
and cooling zone. All three areas of the transport system can
be optionally equipped with a central support for particularly
wide boards. The possibility of reducing the transportation
speed in the cooling zone when using the vacuum enables
the extension of the cooling time of components and there-
fore guarantees an optimum temperature for subsequent
process steps. The throughput of the system is additionally
increased with the expansion of the transport system by a
second track.
The vacuum chamber is installed as an enhancement to the
available peak zones. The integrated pyrolysis and sepa-
rate ltering of the atmosphere extracted from the vacuum
chamber are additional plus points in terms of maintenance
and cleaning. A generously dimensioned opening angle of the
vacuum chamber in the service position enables good access
to the internal mechanisms during maintenance periods.
All heating zones are regulated individually and separated
from each other thermally, guaranteeing exible prole
guidance and a stable reow process. The measurement
of a temperature prole with the vacuum process switched
on shows that despite a very low vacuum < 10 mbar, all
prole settings have been fullled (≤ 3 K/s heating, tL ≤ 90
s, TP ≤ 240 °C). With the help of the heating integrated into
the chamber, the temperature of the components inside
the vacuum unit can be adapted to the settings of the most
common standards. This rened solution ensures a time-
efcient and stable production process.
Efcient, easy to maintain and void-free
Precise pressure and temperature proling
Pressure and temperature prole of a soldering
process with the VisionXP+ Vac
without vacuum
with vacuum
valid for VisionXP+ Vac and Vision Triplex
valid for VisionXP+ Vac and Vision Triplex
valid for VisionXP+ Vac and Vision Triplex
Vision-Series | Vacuum