Vision_Serie_EN_2023 - 第8页
8 Each product has its own requirements in the manufacturing process. Optimized heat tr ansfer over the entire soldering process is the basis for best possible results. The Vision-Series offers exibly controllable pre -…
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1. Single lane transport
one adjustable chain
2. Dual lane transport
two adjustable chains, synchronous/
asynchronous transport speed
3. Multi-track transport
three adjustable chains, synchronous/
asynchronous transport speed
4. Quad lane transport
four adjustable chains, synchronous
transport speed and width adjustment
Transport systems
1.
2.
4.
3.
Reliable, failure-free production guaranteed by absolutely parallel transport
Precise and repeatable adjustment of the transport width
No inuence of the temperature prole by transport or center board support
Reduced maintenance, transport drive mechanism is outside of the process chamber
Ideal for any application due to various transport systems
High process reliability by integrated center board support
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Each product has its own requirements in the
manufacturing process. Optimized heat transfer
over the entire soldering process is the basis for
best possible results.
The Vision-Series offers exibly controllable pre-
heating zones within which your PCB is preheated
and prepared for the actual soldering process. The
temperatures can also be set and controlled via
the fan frequency.
The VisionXP+ is equipped with special nozzle
sheets for optimized heat transfer by means of
uniform air ow over the PCBs. Flow speeds in
the upper and lower heat zones can be separately
controlled, assuring that your PCB is heated up
through and through – completely and uniformly.
This prevents stressing of the material which can
disturb the soldering process. In addition, smaller
componants are not overheated and bigger ones
are still heated through enough.
To ensure that the heat ow in the system runs
stably and the outward heat radiation is as low
as possible, our Vision systems have optimum
insulation between the process chamber and the
exterior wall.
Using precise proling we can generate preci-
sion-reproducible temperature proles which are
tailored to component size, material or process
parameters.
From zero to 240 °C
due to optimized heat transfer
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The centrepiece of our Vision-Series is the process chamber with its
outstanding heat transfer owing to advanced hole nozzle geometry as
well as monitored adjustable overpressure in the heating module, guar-
anteeing homogeneous and gapless heat transfer to the circuit board.
The inert process atmosphere can be assured throughout the entire sol-
dering process and beyond because the closed system ensures that no
external air nds its way into the process chamber. The heat ow within
the system takes place by means of circulation, i.e. the process gas of
the preheating and peak zones is extracted, cleaned and reinserted into
the process at the sides.
With a linear prole, the component is not heated
in a stepped manner during soldering, in fact it
is heated along an identical linear temperature
gradient. Linear proles can reduce cycle times
and can help to reduce soldering errors such as
tombstoning.
The component is brought to a temperature
of at least 240 °C for soldering. Using a saddle
prole the board is gradually heated in line with
pre-dened, individual temperature ranges. Even
components with differing thermal masses are
heated homogeneously and temperature differ-
ences minimised.
Saddle prole
Linear prole
Convection
0s
0°
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60s
40°
80°
120°
160°
200°
240°
120s 180s 240s 300s 360s 420s 480s
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h1 h2 h3 h4 h5 h6 h7 ec4c3p1 p2 p3 c1 c2
217,0 °C
200,0 °C
0s
0°
C
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t
4
60s
40°
80°
120°
160°
200°
240°
120s 180s 240s 300s 360s 420s 480s
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h1 h2 h3 h4 h5 h6 h7 ec4c3p1 p2 p3 c1 c2
217,0 °C
200,0 °C
Separately adjustable heating zones
Reproducible temperature prole
Outstanding process stability with the smallest possible ΔT
Homogenous heat input over the entire PCB thanks to specially designed nozzles
Low maintenance effort
Homogenous heat transfer
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Vision-Series | Heat transfer