X3_X4_Series machine - 第137页
User manual SIPLAC E X-Series 3 Technical data Software Vers ion SR.601.xx 11/ 2005 US Ed ition 3.7 Placem ent heads 137 3.7.4.4 T echnical dat a 3 *) Please note that the component range that can be placed is also affec…
3 Technical data User manual SIPLACE X-Series
3.7 Placement heads Software Version SR.601.xx 11/2005 US Edition
136
Æ The 6-segment Collect&Place head has three axes - the DR or star axis, the Z axis and the
DP axis.
Æ The star rotates about the
star axis
with its 6 segments. The segments hold the sleeves.
There is a nozzle seated on every sleeve, which sucks up the components, and transports
them from the pick-up/placement position (1) to the reject position (2), to the optical centering
position (4) or to the turning position (5).
Æ The
Z axis
performs a vertical movement. Every sleeve that is in the bottom star position (1)
is raised or lowered by this axis, thus picking up the components from the feeder modules
and setting them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pick-up
height of each feeder module track and the placement height for each component. This can
speed up the placement process. The programmed placement force remains constant.
Æ The
DP axis
rotates the optically centered component to the desired placement angle. The
sequences of movements of the rotation and translation axes are controlled by control cir-
cuits. Position and speed sensors send the actual values for the axis movement to the axis
control. The setpoint and actual values are compared and used to determine the force and
speed parameters for the servo amplifier, and thus the axis movement to be performed. The
vacuum values at the nozzle are constantly checked throughout the entire pick-up and place-
ment process in order to keep the placement error rate as low as possible.
User manual SIPLACE X-Series 3 Technical data
Software Version SR.601.xx 11/2005 US Edition 3.7 Placement heads
137
3.7.4.4 Technical data
3
*) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific
standards and the packaging tolerances.
6-segment Collect&Place head with high-resolution
component camera, type 29, 27 x 27, digital
Component range *) 0201 to 27 x 27 mm²
Component specification
Max. height
Min. lead pitch
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.3 mm
0.25 mm for components< 18 x 18 mm²
0.35 mm for components ≥ 18 x 18 mm²
0.14 mm for components < 18 x 18 mm²
0.2 mm for components ≥ 18 x 18 mm²
0.3 x 0.3 mm²
27 x 27 mm²
5 g
Programmed power stage
1
2
3
4
5
Programmed set-down force [N]
2.4 ± 0.5
2.4 ± 0.5
3 + 1
4 + 1
5 + 1
Nozzle types 8 xx, 9 xx
X/Y accuracy ± 45 µm/3 σ, ± 60 µm/4 σ
Angular accuracy ± 0.2°/3 σ, ± 0.3°/4 σ
3 Technical data User manual SIPLACE X-Series
3.7 Placement heads Software Version SR.601.xx 11/2005 US Edition
138
3.7.5 SIPLACE TwinHead for high-precision IC placement
3
Fig. 3.7 - 13 TwinHead for high-precision IC placement
3
(1) Pick&Place module - the TwinHead consists of 2 Pick&Place modules (P&P1 and P&P2)
(2) DP axis
(3) Z axis drive
(4) Incremental distance measuring system for the Z axis