X3_X4_Series machine - 第158页
3 Technical data User manual SIPLACE X-Series 3.11 Vision cameras Software Version SR.601.xx 11/2005 US E dition 158 3.1 1.2 C&P component camera, type 28, 18 x 18, digit al 3.1 1.2.1 Structu re 3 Fig. 3.1 1 - 3 C&am…
User manual SIPLACE X-Series 3 Technical data
Software Version SR.601.xx 11/2005 US Edition 3.11 Vision cameras
157
3.11.1 C&P component camera, type 23, 6 x 6, digital
3.11.1.1 Structure
3
Fig. 3.11 - 2 C&P component camera, type 23, 6 x 6, digital
3
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.11.1.2 Technical data
3
Component dimensions 0.2 x 0.2 mm² to 6 x 6 mm²
Range of components 01005 to 6 x 6 mm²
Min. lead pitch 0.3 mm
Min. ball pitch 0.4 mm
Min. ball diameter 0.2 mm
Field of vision 8 x 8 mm²
Method of illumination Front-lighting (5 levels, programable as required)
3 Technical data User manual SIPLACE X-Series
3.11 Vision cameras Software Version SR.601.xx 11/2005 US Edition
158
3.11.2 C&P component camera, type 28, 18 x 18, digital
3.11.2.1 Structure
3
Fig. 3.11 - 3 C&P component camera, type 28, 18 x 18, digital
3
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.11.2.2 Technical data
3
Component dimensions 0.5 x 0.5 mm² to 18.7 x 18.7 mm²
Range of components 0402 to PLCC44 incl. BGA, µBGA, flip-chip, TSOP, QFP,
SO to SO32, DRAM
Min. lead pitch 0.5 mm
Min. ball pitch 0.45 mm
Min. ball diameter 0.25 mm
Field of vision 24.5 x 24.5 mm²
Method of illumination Front-lighting (5 levels, programable as required)
User manual SIPLACE X-Series 3 Technical data
Software Version SR.601.xx 11/2005 US Edition 3.11 Vision cameras
159
3.11.3 C&P component camera, type 29, 27 x 27, digital
3.11.3.1 Structure
3
Fig. 3.11 - 4 C&P component camera, type 29, 27 x 27, digital
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.11.3.2 Technical data
3
Component dimensions 0.3 x 0.3 mm² to 27 x 27 mm²
Range of components 0201 to 27 x 27 mm²
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Min. lead pitch 0.3 mm
Min. ball pitch 0.25 mm for components < 18 x 18 mm²
0.35 mm for components ≥ 18 x 18 mm²
Min. ball diameter 0.14 mm for components < 18 x 18 mm²
0.2 mm for components ≥ 18 x 18 mm²
Field of vision 31 x 31 mm²
Method of illumination Front-lighting (5 levels, programable as required)